Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive

2010 ◽  
Vol 30 (2) ◽  
pp. 80-88 ◽  
Author(s):  
Youliang Guan ◽  
Xu Chen ◽  
Fengqin Li ◽  
Hong Gao
2016 ◽  
Vol 67 (3) ◽  
pp. 177-184
Author(s):  
Martin Hirman ◽  
Frantisek Steiner

Abstract This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives “EPO-TEKⓇ H20S” and “MG8331S” on three types of substrates (FR-4, MELINEXⓇST504, DuPont™ PyraluxⓇAC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.


2020 ◽  
Vol 31 (14) ◽  
pp. 10947-10961 ◽  
Author(s):  
Hossein Derakhshankhah ◽  
Rahim Mohammad-Rezaei ◽  
Bakhshali Massoumi ◽  
Mojtaba Abbasian ◽  
Aram Rezaei ◽  
...  

2015 ◽  
Vol 7 (24) ◽  
pp. 13685-13692 ◽  
Author(s):  
Hu-Ming Ren ◽  
Ying Guo ◽  
Sheng-Yun Huang ◽  
Kai Zhang ◽  
Matthew M.F. Yuen ◽  
...  

2018 ◽  
Vol 8 (4) ◽  
pp. 1074-1081 ◽  
Author(s):  
Torsten Geipel ◽  
Michel Meinert ◽  
Achim Kraft ◽  
Ulrich Eitner

2020 ◽  
Vol 49 (11) ◽  
pp. 6572-6581
Author(s):  
S. H. S. M. Fadzullah ◽  
Z. Adnan ◽  
G. Omar ◽  
Z. Mustafa ◽  
N. A. B. Masripan ◽  
...  

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