Experimental investigation of the effect of heat sink orientation on subcooled flow boiling performance in a rectangular microgap channel

2018 ◽  
Vol 120 ◽  
pp. 1341-1357 ◽  
Author(s):  
R. Ajith Krishnan ◽  
K.R. Balasubramanian ◽  
S. Suresh
Keyword(s):  
Experimental Investigation ◽  
Heat Sink ◽  
Flow Boiling ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow

Experimental investigation of bubble behaviors in subcooled flow boiling

2012 ◽  
Vol 21 (2) ◽  
pp. 184-188 ◽  
Author(s):  
Peng Guan ◽  
Li Jia ◽  
Liaofei Yin ◽  
Shuo Wang
Keyword(s):  
Experimental Investigation ◽  
Flow Boiling ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow

scholarly journals Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling

2021 ◽  
Vol 2116 (1) ◽  
pp. 012052
Author(s):  
David Olugbenga Ariyo ◽  
Tunde Bello-Ochende
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
Flow Boiling ◽  
High Heat ◽  
Geometric Optimization ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Microchannel Heat Sinks

Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

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