microchannel heat sinks
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Author(s):  
Vivian Y.S. Lee ◽  
Gary Henderson ◽  
Alex Reip ◽  
Tassos G. Karayiannis

Micromachines ◽  
2022 ◽  
Vol 13 (1) ◽  
pp. 95
Author(s):  
Tao Wu ◽  
Lizhi Wang ◽  
Yicun Tang ◽  
Chao Yin ◽  
Xiankai Li

Developments in applications such as rocket nozzles, miniature nuclear reactors and solar thermal generation pose high-density heat dissipation challenges. In these applications, a large amount heat must be removed in a limited space under high temperature. In order to handle this kind of cooling problem, this paper proposes liquid metal-based microchannel heat sinks. Using a numerical method, the flow and heat transfer performances of liquid metal-based heat sinks with different working fluid types, diverse microchannel cross-section shapes and various inlet velocities were studied. By solving the 3-D steady and conjugate heat transfer model, we found that among all the investigated cases, lithium and circle were the most appropriate choices for the working fluid and microchannel cross-section shape, respectively. Moreover, inlet velocity had a great influence on the flow and heat transfer performances. From 1 m/s to 9 m/s, the pressure drop increased as much as 65 times, and the heat transfer coefficient was enhanced by about 74.35%.


2022 ◽  
Vol 171 ◽  
pp. 107229
Author(s):  
Shuo-Lin Wang ◽  
Ji-Feng Zhu ◽  
Di An ◽  
Ben-Xi Zhang ◽  
Liu-Yi Chen ◽  
...  

Fluids ◽  
2021 ◽  
Vol 7 (1) ◽  
pp. 7
Author(s):  
Stefano Savino ◽  
Carlo Nonino

Counter-flow double-layered microchannel heat sinks are very effective for thermal control of electronic components; however, they require rather complicated headers and flow maldistribution can also play a negative role. The cross-flow configuration allows a much simpler header design and the thermal performance becomes similar to that provided by the counter-flow arrangement if the velocity distribution in the microchannels is not uniform. The aim of this work is to show the possibility of achieving a favorable flow distribution in the microchannels of a cross-flow double-layered heat sink with an adequate header design and the aid of additional elements such as full or partial height baffles made of solid or porous materials. Turbulent RANS numerical simulations of the flow field in headers are carried out with the commercial code ANSYS Fluent. The flow in the microchannel layers is modeled as that in a porous material, whose properties are derived from pressure drop data obtained using an in-house FEM code. It is demonstrated that, with an appropriate baffle selection, inlet headers of cross-flow microchannel heat sinks yield velocity distributions very close to those that would allow optimal hotspot management in electronic devices.


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