Modelling continuous dynamic recrystallization of aluminum alloys based on the polycrystal plasticity approach

2020 ◽  
Vol 131 ◽  
pp. 102710 ◽  
Author(s):  
S.F. Chen ◽  
D.Y. Li ◽  
S.H. Zhang ◽  
H.N. Han ◽  
H.W. Lee ◽  
...  
2017 ◽  
Vol 53 (6) ◽  
pp. 4563-4573 ◽  
Author(s):  
Giovanni Maizza ◽  
Renato Pero ◽  
Maria Richetta ◽  
Roberto Montanari

2014 ◽  
Vol 794-796 ◽  
pp. 784-789 ◽  
Author(s):  
Rustam Kaibyshev ◽  
Sergey Malopheyev

Mechanisms of dynamic recrystallization operating at severe plastic deformation in a wide temperature range are reviewed for aluminum alloys. The main mechanism of grain refinement in all aluminum alloys is continuous dynamic recrystallization (CDRX). Temperature, deformation process and distribution of secondary phases strongly affect the CDRX mechanism. Initial formation of geometrically necessary boundaries (GNBs) and a dispersion of nanoscale particles accelerate CDRX facilitating the formation of a 3D network of low-angle boundaries (LAB) followed by their gradual transformation to high-angle boundaries (HAB). At high and intermediate temperatures, 3D networks of LABs may evolve due to rearrangement of lattice dislocations by climb, and mutual intersection of GNB, respectively. At high temperatures, in aluminum alloys containing no nanoscale dispersoids the CDRX occurs through the impingement of initial boundaries forced by deformation-induced LABs. This recrystallization process is termed as geometric dynamic recrystallization (GDRX). At low temperatures, the extensive grain refinement occurs through a continuous reaction which is distinguished from CDRX by restricted rearrangement of lattice dislocation. Introduction of large misorientation may occur through the formation of 3D networks of GNBs, only.


2021 ◽  
Author(s):  
Marta Kuczynska ◽  
Ulrich Becker ◽  
Youssef Maniar ◽  
Steffen Weihe

Abstract The reoccurring cyclic load imposed onto soldered electronic components during their operation time leads to accumulation of inelastic strains in the structure. On a microscale level, the degree of plastic deformation is determined by the formation and annihilation of dislocations, leading to continuous refinement by creation of new grain boundaries, precipitates relocation and growth. This microstructure rearrangement, triggered by an increasing amount of inelastic deformation, is defined as dynamic recrystallization. This work presents a macroscale modelling approach for the description of continuous dynamic recrystallization observed in Sn-based solder connections. The model used in this work describes kinetics of macroscopic gradual evolution of equivalent grain size, where the initial grain size is continuously refined with increasing accumulated inelastic strain until a saturation grain size is reached. The rate and distribution of dynamic recrystallization is further numerically modelled dependent on the effective accumulated inelastic strain and governing stress multiaxiality. A parameter study of the presented model and its employment in finite element (FE) simulation is further described. Finally, FE simulation of the grain size evolution is demonstrated on an example of a bulky sample under isothermal cyclic mechanical loading, as well as a BGA-like structure under tensile, shear and mixed mode cyclic load.


2020 ◽  
Vol 822 ◽  
pp. 153282 ◽  
Author(s):  
David Canelo-Yubero ◽  
Zsolt Kovács ◽  
J.F. Thierry Simonet Fotso ◽  
Domonkos Tolnai ◽  
Norbert Schell ◽  
...  

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