High-temperature plane-strain compression tests were performed on Fe-3.0 wt.% Si alloy from 900 °C to 1150 °C at strain rates of 5 s−1 to 1 s−1, and the texture development from different initial textures was investigated by means of electron backscattered diffraction. Dynamic recrystallization occurs by strain-induced boundary migration, and the evolutions of the microstructure and different texture components vary with the initial texture. The critical orientation boundary separating the weakened and enhanced texture components moves with the initial texture, and a quantitative relationship is established to represent the dependence of the critical Taylor factor on the instantaneous texture. A model is proposed to describe the dynamic recrystallization texture by incorporating the oriented nucleation probability with a variable critical Taylor factor. The present work could improve the accuracy of hot deformation texture prediction based on strain-induced boundary migration.