A novel simulation of continuous dynamic recrystallization process for 2219 aluminium alloy using cellular automata technique

2021 ◽  
Vol 815 ◽  
pp. 141256
Author(s):  
Lei Liu ◽  
Yunxin Wu ◽  
Abdulrahaman Shuaibu Ahmad
Keyword(s):  
Cellular Automata ◽  
Dynamic Recrystallization ◽  
Aluminium Alloy ◽  
Recrystallization Process ◽  
Continuous Dynamic Recrystallization ◽  
Continuous Dynamic

Mechanisms of Dynamic Recrystallization in Aluminum Alloys

2014 ◽  
Vol 794-796 ◽  
pp. 784-789 ◽  
Author(s):  
Rustam Kaibyshev ◽  
Sergey Malopheyev
Keyword(s):  
Aluminum Alloys ◽  
Dynamic Recrystallization ◽  
Grain Refinement ◽  
Temperature Deformation ◽  
Recrystallization Process ◽  
Secondary Phases ◽  
Continuous Dynamic Recrystallization ◽  
3D Network ◽  
Continuous Dynamic ◽  
3D Networks

Mechanisms of dynamic recrystallization operating at severe plastic deformation in a wide temperature range are reviewed for aluminum alloys. The main mechanism of grain refinement in all aluminum alloys is continuous dynamic recrystallization (CDRX). Temperature, deformation process and distribution of secondary phases strongly affect the CDRX mechanism. Initial formation of geometrically necessary boundaries (GNBs) and a dispersion of nanoscale particles accelerate CDRX facilitating the formation of a 3D network of low-angle boundaries (LAB) followed by their gradual transformation to high-angle boundaries (HAB). At high and intermediate temperatures, 3D networks of LABs may evolve due to rearrangement of lattice dislocations by climb, and mutual intersection of GNB, respectively. At high temperatures, in aluminum alloys containing no nanoscale dispersoids the CDRX occurs through the impingement of initial boundaries forced by deformation-induced LABs. This recrystallization process is termed as geometric dynamic recrystallization (GDRX). At low temperatures, the extensive grain refinement occurs through a continuous reaction which is distinguished from CDRX by restricted rearrangement of lattice dislocation. Introduction of large misorientation may occur through the formation of 3D networks of GNBs, only.

Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading

2021 ◽  
Author(s):  
Marta Kuczynska ◽  
Ulrich Becker ◽  
Youssef Maniar ◽  
Steffen Weihe
Keyword(s):  
Grain Size ◽  
Dynamic Recrystallization ◽  
Cyclic Load ◽  
Fe Simulation ◽  
Operation Time ◽  
Inelastic Strain ◽  
Parameter Study ◽  
Continuous Dynamic Recrystallization ◽  
Gradual Evolution ◽  
Continuous Dynamic

Abstract The reoccurring cyclic load imposed onto soldered electronic components during their operation time leads to accumulation of inelastic strains in the structure. On a microscale level, the degree of plastic deformation is determined by the formation and annihilation of dislocations, leading to continuous refinement by creation of new grain boundaries, precipitates relocation and growth. This microstructure rearrangement, triggered by an increasing amount of inelastic deformation, is defined as dynamic recrystallization. This work presents a macroscale modelling approach for the description of continuous dynamic recrystallization observed in Sn-based solder connections. The model used in this work describes kinetics of macroscopic gradual evolution of equivalent grain size, where the initial grain size is continuously refined with increasing accumulated inelastic strain until a saturation grain size is reached. The rate and distribution of dynamic recrystallization is further numerically modelled dependent on the effective accumulated inelastic strain and governing stress multiaxiality. A parameter study of the presented model and its employment in finite element (FE) simulation is further described. Finally, FE simulation of the grain size evolution is demonstrated on an example of a bulky sample under isothermal cyclic mechanical loading, as well as a BGA-like structure under tensile, shear and mixed mode cyclic load.

scholarly journals In-situ characterization of continuous dynamic recrystallization during hot torsion of an Al–Si–Mg alloy

2020 ◽  
Vol 822 ◽  
pp. 153282 ◽  
Author(s):  
David Canelo-Yubero ◽  
Zsolt Kovács ◽  
J.F. Thierry Simonet Fotso ◽  
Domonkos Tolnai ◽  
Norbert Schell ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Mg Alloy ◽  
In Situ Characterization ◽  
Continuous Dynamic Recrystallization ◽  
Hot Torsion ◽  
Continuous Dynamic

scholarly journals Microstructure and Texture Evolution of Mg-Gd-Y-Zr Alloy during Reciprocating Upsetting-Extrusion

Materials ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 4932
Author(s):  
Guoqin Wu ◽  
Jianmin Yu ◽  
Leichen Jia ◽  
Wenlong Xu ◽  
Beibei Dong ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Basal Plane ◽  
Deformation Process ◽  
Texture Evolution ◽  
Extrusion Process ◽  
Fiber Texture ◽  
Recrystallization Process ◽  
Application Range ◽  
Continuous Dynamic Recrystallization ◽  
Cumulative Strain

Reciprocating Upsetting-Extrusion (RUE) deformation process can significantly refine the grains size and weaken the basal plane texture by applying a large cumulative strain to the alloy, which is of great significance to weaken the anisotropy of magnesium (Mg) alloys and increase the application range. In this paper, the Mg-8.27Gd-3.18Y-0.43Zr (wt %) alloy was subjected to isothermal multi-passes RUE. The microstructure and texture evolution, crystal orientation-dependent deformation mechanism of the alloy after deformation were investigated. The results clearly show that with the increase of RUE process, the grains are significantly refined through continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX) mechanisms, the uniformity of the microstructure is improved, and the texture intensity is reduced. At the same time, a large number of particle phases are dynamically precipitated during the deformation process, promoting grain refinement by the particle-stimulated nucleation (PSN) mechanism. The typical [10-10] fiber texture is produced after one pass due to the basal plane of the deformed grains with a relatively high proportion is gradually parallel to the ED during extrusion process. However, the texture concentration is reduced compared with the traditional extrusion deformation, indicating that the upsetting deformation has a certain delay effect on the subsequent extrusion texture generation. After three or four passes deformation, the grain orientation is randomized due to the continuous progress of the dynamic recrystallization process.

scholarly journals Investigation on Sub-Solvus Recrystallization Mechanisms in an Advanced γ-γ’ Nickel-Based Superalloy GH4151

Materials ◽  
2020 ◽  
Vol 13 (20) ◽  
pp. 4553
Author(s):  
Shaomin Lv ◽  
Jinbin Chen ◽  
Xinbo He ◽  
Chonglin Jia ◽  
Kang Wei ◽  
...  
Keyword(s):  
Dynamic Recrystallization ◽  
Hot Deformation ◽  
Energy Surface ◽  
Electron Backscatter Diffraction ◽  
True Strain ◽  
Continuous Dynamic Recrystallization ◽  
Nickel Based Superalloy ◽  
Transmission Electron ◽  
Continuous Dynamic ◽  
Backscatter Diffraction

Sub-solvus dynamic recrystallization (DRX) mechanisms in an advanced γ-γ’ nickel-based superalloy GH4151 were investigated by isothermal compression experiments at 1040 °C with a strain rate of 0.1 s−1 and various true strain of 0.1, 0.3, 0.5, and 0.7, respectively. This has not been reported in literature before. The electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) technology were used for the observation of microstructure evolution and the confirmation of DRX mechanisms. The results indicate that a new dynamic recrystallization mechanism occurs during hot deformation of the hot-extruded GH4151 alloy. The nucleation mechanism can be described as such a feature, that is a primary γ’ (Ni3(Al, Ti, Nb)) precipitate embedded in a recrystallized grain existed the same crystallographic orientation, which is defined as heteroepitaxial dynamic recrystallization (HDRX). Meanwhile, the conventional DRX mechanisms, such as the discontinuous dynamic recrystallization (DDRX) characterized by bulging grain boundary and continuous dynamic recrystallization (CDRX) operated through progressive sub-grain merging and rotation, also take place during the hot deformation of the hot-extruded GH4151 alloy. In addition, the step-shaped structures can be observed at grain boundaries, which ensure the low-energy surface state during the DRX process.

Hot Compression Deformation Behavior of Mg-Gd-Y-Zn-Zr Alloy

2014 ◽  
Vol 680 ◽  
pp. 15-22 ◽  
Author(s):  
Guang Lu ◽  
Zhi Ping Xie ◽  
Zhi Min Zhang ◽  
Yong Biao Yang ◽  
Bao Cheng Li
Keyword(s):  
Flow Stress ◽  
Magnesium Alloy ◽  
Dynamic Recrystallization ◽  
Strain Rate ◽  
Great Influence ◽  
Peak Stress ◽  
Maximum Error ◽  
Continuous Dynamic Recrystallization ◽  
Stress Behaviors ◽  
Continuous Dynamic

The deformation behaviors of as-cast Mg-11Gd-2Y-Zn-Zr magnesium alloy were investigated by compression test with Gleeble-1500 thermal simulator at temperature of 623-753K and strain rate of 0.01-0.5 s-1. The flow stress behaviors of the magnesium alloy were carried out at a strain of 0.7. The strain rate and deformation temperature had great influence on the flow stress behaviors. The flow stress increases with increasing strain rate and decreasing temperature. The flow stress has more than one peak stress at a strain rate of 0.5s-1showing continuous dynamic recrystallization (DRX) mechanism, while other flow stresses exhibited only one peak stress indicating discontinuous dynamic recrystallization (DDRX) mechanism. It was also found that the flow stress behavior could be described by the hyperbolic sine constitutive equation, in which the determined average activation energy is 273.426 kJ·mol-1. The maximum error value between calculated value and experimental value is 5.5%. The deformation map was also established, and the best parameter for hot working was found to be 0.1s-1/753k approximately.

Dynamic Recrystallization of Zircaloy-4 during Working within the Upper α-Range

2004 ◽  
Vol 467-470 ◽  
pp. 1151-1156 ◽  
Author(s):  
Cédric Chauvy ◽  
Pierre Barbéris ◽  
Frank Montheillet
Keyword(s):  
Dynamic Recrystallization ◽  
Large Strain ◽  
Large Angle ◽  
Rate Sensitivity ◽  
Large Strains ◽  
Strain Rates ◽  
Compression Tests ◽  
Continuous Dynamic Recrystallization ◽  
Ebsd Technique ◽  
Continuous Dynamic

Compression tests were used to simulate simple deformation paths within the upper a-range of Zircaloy-4 (i.e. 500°C-750°C). The mechanical behaviour reveals two different domains : at low temperatures and large strain rates, strain hardening takes place before flow softening, whereas this first stage disappears at lower flow stress levels. Strain rate sensitivity and activation energy were determined for both domains. Dynamic recrystallization was investigated using the Electron BackScattering Diffraction (EBSD) technique. It appears that the mechanism involved here is continuous dynamic recrystallization (CDRX), based on the increasing misorientation of subgrain boundaries and their progressive transformation into large angle boundaries. At low strains (e £ 0.3), CDRX kinetics are similar whatever the deformation conditions, while higher temperatures and lower strain rates promote recrystallization at large strains.

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