scholarly journals Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading

2007 ◽  
Vol 44 (16) ◽  
pp. 5247-5271 ◽  
Author(s):  
H. Yuan ◽  
J.F. Chen ◽  
J.G. Teng ◽  
X.Z. Lu
1991 ◽  
Vol 113 (3) ◽  
pp. 240-243 ◽  
Author(s):  
E. Suhir

A stress analysis model is developed to assess the stresses in solder joints caused by thermal contraction mismatch between a low expansion flex-circuit (FC) and a high expansion rigid substrate. It is shown that application of low expansion FCs can result in significant stress relief for solder joints. This is due to the fact that the force acting on a joint cannot exceed the buckling force for the adjacent portion of the FC. It is shown that the strains in solder joints interconnecting FCs to rigid substrates can be made very small, thereby resulting in a substantially longer fatigue life of the interconnection. In the executed example these strains are about two orders of magnitude smaller, than in the case of a rigid board. The obtained results can be utilized as guidance in physical design of assemblies with FCs.


Materials ◽  
2019 ◽  
Vol 12 (15) ◽  
pp. 2403 ◽  
Author(s):  
Shiuh-Chuan Her ◽  
Cheng-Feng Chan

The use of adhesively bonded joints in place of traditional joining techniques such as bolted or rivet joints is becoming greatly popular in recent years. Interfacial stress in the adhesive is critical to the strength of adhesively bonded joints. It is necessary to predict the interfacial stresses accurately to ensure the safety of joints. In this work, an analytical model is explicitly presented to evaluate the stresses in a double lap joint. The equilibrium equations in the adhesive overlap region are derived on the basis of elasticity theory. The governing equations are presented in terms of shear and peel stresses in the adhesive. Analytical solutions are derived for the shear and peel stresses, which are considered to be the main reason for the failure of the double lap joint. To verify the analytical solutions, the finite element method is conducted using the commercial package ANSYS. Results from the analytical solution agree well with finite element results and numerical investigations available in the literature. The effect of the adhesive thickness, shear modulus, adherend Young’s modulus and bonding length on the shear and peel stresses in the adhesive of the double lap joint are studied. Numerical results demonstrate that both the maximum shear and peel stress occur at both ends of the bonding region. The maximum values of the shear and peel stresses increase as the adhesive thickness decreases and as the adhesive shear modulus increases provided that the adhesive thickness is sufficiently small. The simplicity and capability to obtain analytical expressions of the shear and peel stresses for double lap adhesive bonded joints makes the proposed analytical model applicable for the stress analysis and preliminary structural design.


2012 ◽  
Vol 44 (6) ◽  
pp. 815-837 ◽  
Author(s):  
Sheng-Wang Hao ◽  
Yan Liu ◽  
Xiao-Dan Liu

2009 ◽  
Vol 23 (6) ◽  
pp. 2394-2401 ◽  
Author(s):  
Li-juan Li ◽  
Yong-chang Guo ◽  
Pei-yan Huang ◽  
Feng Liu ◽  
Jun Deng ◽  
...  

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