Magnetic behavior of binary intermetallic compound YPd3

2009 ◽  
Vol 476 (1-2) ◽  
pp. 14-18 ◽  
Author(s):  
Abhishek Pandey ◽  
Chandan Mazumdar ◽  
R. Ranganathan
ChemInform ◽  
2009 ◽  
Vol 40 (31) ◽  
Author(s):  
Abhishek Pandey ◽  
Chandan Mazumdar ◽  
R. Ranganathan

ChemInform ◽  
2010 ◽  
Vol 33 (18) ◽  
pp. no-no
Author(s):  
F. Canepa ◽  
M. Napoletano ◽  
P. Manfrinetti ◽  
F. Merlo

2016 ◽  
Vol 55 (24) ◽  
pp. 12953-12961 ◽  
Author(s):  
Roman A. Khalaniya ◽  
Andrei V. Mironov ◽  
Valeriy Yu. Verchenko ◽  
Anton Jesche ◽  
Alexander A. Tsirlin ◽  
...  

2013 ◽  
Vol 690-693 ◽  
pp. 2598-2600 ◽  
Author(s):  
Fen Fang Tan ◽  
Kang Du

Test of 5052 Al alloy contact reactive brazing has been conducted in the case of special brazing parameters, using Cu foil-Mg power-Cu foil as reaction layer material, the microstructure were analyzed and discussed primarily. The results show that the brazing seam structure consisted of α-Al solid solution and CuAl2 intermetallic compound; the organizations of brazed seam include Al (Mg, Cu) solid solution CuAl2 binary intermetallic compound, complicated ternary intermetallic compound and Al2MgO4.


2020 ◽  
Vol 120 ◽  
pp. 106740
Author(s):  
Binita Mondal ◽  
Shovan Dan ◽  
Sudipta Mondal ◽  
R.N. Bhowmik ◽  
R. Ranganathan ◽  
...  

1969 ◽  
Vol 26 (1) ◽  
pp. 207-207 ◽  
Author(s):  
Takao Goto ◽  
Masayoshi Ohashi ◽  
Kazuo Kamigaki

2001 ◽  
Vol 157 (1) ◽  
pp. 225-232 ◽  
Author(s):  
Hyungrak Kim ◽  
Marilyn M. Olmstead ◽  
Julia Y. Chan ◽  
Paul C. Canfield ◽  
Ian R. Fisher ◽  
...  

1981 ◽  
Vol 24 (11) ◽  
pp. 6762-6765 ◽  
Author(s):  
W. Potzel ◽  
J. Moser ◽  
G. M. Kalvius ◽  
C. H. de Novion ◽  
J. C. Spirlet ◽  
...  

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