Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co(P) layer deposited on a Cu substrate

2016 ◽  
Vol 662 ◽  
pp. 475-483 ◽  
Author(s):  
Chao-hong Wang ◽  
Chun-chieh Wen ◽  
Che-yang Lin
Keyword(s):  
Solid State ◽  
Interfacial Reactions ◽  
Cu Substrate

scholarly journals Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

2006 ◽  
Vol 504 (1-2) ◽  
pp. 410-415 ◽  
Author(s):  
Aditya Kumar ◽  
Zhong Chen ◽  
S.G. Mhaisalkar ◽  
C.C. Wong ◽  
Poi Siong Teo ◽  
...  
Keyword(s):  
Solid State ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Electroless Ni

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

2007 ◽  
Vol 22 (10) ◽  
pp. 2817-2824 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Hyun-Suk Chun ◽  
Hoo-Jeong Lee ◽  
Seung-Boo Jung
Keyword(s):  
High Temperature ◽  
Solid State ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Microstructural Evolution ◽  
Surface Finish ◽  
Solder Matrix ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Study Results

The microstructural evolution and interfacial reactions of fluxless-bonded, Au-20wt%Sn/Cu solder joint were investigated during reflow and aging. After reflowing at 310 °C, only one thick and irregularly shaped ζ(Cu) layer was formed at the interface. After the prolonged reflow reaction, the AuCu layer was formed between the ζ(Cu) layer and the Cu substrate. During reflowing, the Cu substrate reacted primarily with the ζ-phase in the solder matrix. The solid-state interfacial reaction was much faster at 250 °C than at 150 °C. After aging at 250 °C for 100 h, thick ζ(Cu), AuCu and AuCu3 IMC layers were formed at the interface. The formation of the AuCu3 intermetallic compound (IMC) was caused by Cu enrichment at the AuCu/Cu layer interface. After aging for 500 h, cracks were observed inside the interfacial AuCu layer. The study results clearly demonstrate the need for an alternative surface finish on Cu, to ensure the high temperature reliability of the Au-20Sn/Cu solder joint.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

2017 ◽  
Vol 124 ◽  
pp. 250-259 ◽  
Author(s):  
Ming Yang ◽  
Yong-Ho Ko ◽  
Junghwan Bang ◽  
Taek-Soo Kim ◽  
Chang-Woo Lee ◽  
...  
Keyword(s):  
Solid State ◽  
Interfacial Reactions ◽  
Ag Addition ◽  
Cu Substrate

scholarly journals Probing Solid–Solid Interfacial Reactions in All-Solid-State Sodium-Ion Batteries with First-Principles Calculations

2017 ◽  
Vol 30 (1) ◽  
pp. 163-173 ◽  
Author(s):  
Hanmei Tang ◽  
Zhi Deng ◽  
Zhuonan Lin ◽  
Zhenbin Wang ◽  
Iek-Heng Chu ◽  
...  
Keyword(s):  
Solid State ◽  
First Principles ◽  
Interfacial Reactions ◽  
Sodium Ion ◽  
Sodium Ion Batteries ◽  
First Principles Calculations

Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate

2019 ◽  
Vol 6 (7) ◽  
pp. 076310
Author(s):  
Nifa Bao ◽  
Xiaowu Hu ◽  
Qinglin Li ◽  
Shuang Li
Keyword(s):  
Interfacial Reactions ◽  
Cu Substrate

Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

2007 ◽  
Vol 437 (1-2) ◽  
pp. 169-179 ◽  
Author(s):  
Peng Sun ◽  
Cristina Andersson ◽  
Xicheng Wei ◽  
Zhaonian Cheng ◽  
Dongkai Shangguan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Sandwich Structure ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Cu Metallization
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