Interdiffusion kinetics and solid-state reaction mechanism between Cr2O3 and calcium ferrite based on diffusion couple method

2021 ◽  
Vol 865 ◽  
pp. 158754
Author(s):  
Bojian Chen ◽  
Tao Jiang ◽  
Mi Zhou ◽  
Lin Li ◽  
Jing Wen ◽  
...  
2017 ◽  
Vol 57 (10) ◽  
pp. 1762-1766 ◽  
Author(s):  
Jianchao Zheng ◽  
Xiaojun Hu ◽  
Zhongshan Ren ◽  
Xiangxin Xue ◽  
Kuochih Chou

2013 ◽  
Vol 580 ◽  
pp. 182-186 ◽  
Author(s):  
Zhongshan Ren ◽  
Xiaojun Hu ◽  
Xiangxin Xue ◽  
Kuochih Chou

2021 ◽  
pp. 122172
Author(s):  
Chrystian G.M. Lima ◽  
Allan J.M. Araújo ◽  
Rinaldo M. Silva ◽  
Rafael A. Raimundo ◽  
João P.F. Grilo ◽  
...  

2003 ◽  
Vol 18 (1) ◽  
pp. 4-7 ◽  
Author(s):  
Y. C. Sohn ◽  
Jin Yu ◽  
S. K. Kang ◽  
W. K. Choi ◽  
D. Y. Shih

The reaction mechanism between electroless Ni–P and Sn was investigated to understand the effects of Sn on solder reaction-assisted crystallization at low temperatures as well as self-crystallization of Ni–P at high temperatures. Ni3Sn4 starts to form in a solid-state reaction well before Sn melts. Heat of reaction for Ni3Sn4 was measured during the Ni–P and Sn reaction (241.2 J/g). It was found that the solder reaction not only promotes crystallization at low temperatures by forming Ni3P in the P-rich layer but also facilitates self-crystallization of Ni–P by reducing the transformation temperature and heat of crystallization. The presence of Sn reduces the self-crystallization temperature of Ni–P by about 10 °C. The heat of crystallization also decreases with an increased Sn thickness.


2010 ◽  
Vol 21 (29) ◽  
pp. 295603 ◽  
Author(s):  
Parul Sharma ◽  
J V Anguita ◽  
V Stolojan ◽  
S J Henley ◽  
S R P Silva

2017 ◽  
Vol 46 (10) ◽  
pp. 5563-5569 ◽  
Author(s):  
Lu Gao ◽  
Wancheng Zhou ◽  
Fa Luo ◽  
Dongmei Zhu

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