Experimental and simulation investigation of multi-tooth cutting process of long fiber using copper wire continuous feeding

2019 ◽  
Vol 273 ◽  
pp. 116252 ◽  
Author(s):  
Wei Zhou ◽  
Shuangli Li ◽  
Ruiliang Liu ◽  
Xuyang Chu
Keyword(s):  
Copper Wire ◽  
Cutting Process ◽  
Continuous Feeding ◽  
Tooth Cutting

Scanning and Transmission Electron Microscopy of Endomentrium in Women Wearing TCu-380-A IUD 's

1977 ◽  
Vol 35 ◽  
pp. 666-667
Author(s):  
A. Gonzalez Angulo ◽  
R. Berlioz ◽  
R. Aznar
Keyword(s):  
Copper Wire ◽  
Uterine Cavity ◽  
Morphological Evidence ◽  
Secretory Phase ◽  
Ultrastructural Studies ◽  
Proliferative Phase ◽  
Contraceptive Devices ◽  
Transmission Electron ◽  
Intrauterine Contraceptive ◽  
Myelin Figure

Recent ultrastructural studies on endometrial tissues from women wearing copper, wire intrauterine devices have disclosed morphological evidence of impaired glycogen degradation and secretion resulting in interference with the viability of blastocysts. Reduced microapocrine secretion observed with the scanning electron microscope supports this (1). In addition, organelle modifications have been observed in the epithelial cells of these women. The changes are seen in biopsies taken in the proliferative phase of the cycle and consist of mitochondrial vacuolation and myelin figure formation. These modifications disappear in the secretory phase and therefore have been regarded as reversible (2).The aim of the present studies was to investigate surface epithelial changes as well as organelle modifications in relation to the site of contact with an IUD that releases greater amounts of copper. Endometrial tissue was obtained from the uterine cavity of four young women wearing TCu-380-A intrauterine contraceptive devices for 4-6 weeks.

Method to evaluate residual stresses in the laser cutting process

2002 ◽  
Vol 12 (1) ◽  
pp. 27-41 ◽  
Author(s):  
Y. Zamachtchikov ◽  
F. Breaban ◽  
P. Vantomme ◽  
A. Deffontaine
Keyword(s):  
Residual Stresses ◽  
Laser Cutting ◽  
Cutting Process

Reduction of AC Copper Loss in Rectangular Copper Wire using Magnetic Path Control Technology

2020 ◽  
Vol 140 (7) ◽  
pp. 364-371
Author(s):  
Kenta Torishima ◽  
Kazuhiro Shimura ◽  
Mitsuhide Sato ◽  
Tsutomu Mizuno
Keyword(s):  
Copper Wire ◽  
Control Technology ◽  
Copper Loss ◽  
Path Control

Optimization of Tool Travel Path in A Multiple Holes Cutting Process By Genetic Algorithm

2013 ◽  
Vol 3 (1) ◽  
pp. 30-36
Author(s):  
Neeraj Sharma ◽  
◽  
Rahul Dev Gupta ◽  
Nirmal Kumar ◽  
◽  
...  
Keyword(s):  
Genetic Algorithm ◽  
Cutting Process ◽  
Travel Path ◽  
Multiple Holes

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

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