Higher-noble dental alloys (Au, Ag, and Pd) are the most desirable for dentistry applications, but they are expensive. Low-noble (Ag, Pd, Cu) dental alloys are alternatives to higher-noble ones due to their lower price. In this regard, the paper supports the price lowering of dental alloy by increasing the Cu content, i.e., a new 58Ag24Pd11Cu2Au2Zn1.5In1.5Sn dental alloy. The increasing addition of the Cu leads to a complex structure consisting of a solid solution that engulfs compounds of micrometric and nanometric sizes. The 58Ag24Pd11Cu2Au2Zn1.5In1.5Sn has demonstrated a much better electrochemical corrosion behavior in artificial saliva compared to the Paliag and Unique White dental alloys. The improved corrosion behavior of the new alloy is supported by the diminishing of the Cu selective diffusion into the electrolyte due to its retaining into compounds and into Ag-Pd solid solution. Also, the synergic effects of Cu, Zn, In, Sn may improve the corrosion resistance, but they have strengthened the 58Ag24Pd11Cu2Au2Zn1.5In1.5Sn matrix. The main finding addressed in the paper consists in a new 58Ag24Pd11Cu2Au2Zn1.5In1.5Sn dental alloy with improved corrosion resistance in artificial saliva.
Electrochemical corrosion behavior of Ti-35Nb-7Zr-5Ta powder metallurgic alloys after Hot Isostatic Process in fluorinated artificial saliva
