Effect of thermal contact heat transfer on solidification of Pb–Sn and Pb-free solders

2007 ◽  
Vol 28 (3) ◽  
pp. 1006-1011 ◽  
Author(s):  
Titus Chellaih ◽  
Girish Kumar ◽  
K. Narayan Prabhu
2021 ◽  
Vol 2116 (1) ◽  
pp. 012024
Author(s):  
Thorsten Helmig ◽  
Tim Göttlich ◽  
Reinhold Kneer

Abstract The quantification of heat flow between machine tool components is of major importance for a precise thermal prediction of the entire system. A common coupling condition between individual components is the contact heat transfer coefficient connecting the temperature field with the corresponding heat transfer at the investigated interface. However, the majority of numerical and analytical approaches assume isotropic contact surface profiles and neglect distinct surface structures caused by the manufacturing process. This assumption causes inaccuracies in the modeling as isotropic surfaces lead to an overprediction in heat transfer. Hence, this paper presents a novel approach to generate surface structures for numerical calculations considering the used machining parameters. Predicted contact heat transfer coefficients of the old as well as the new generation approach are presented and compared to experimental results offering the basis for future comprehensive investigations considering multiple parameters and materials.


1997 ◽  
Vol 28 (4-6) ◽  
pp. 393-397
Author(s):  
N. Yu. Koloskova ◽  
V. V. Dubrovskaya ◽  
V. V. Orlyanskii

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