Investigation on experiments and numerical modelling of the residual stress distribution in deformed surface layer of Ti–6Al–4V after shot peening

2012 ◽  
Vol 41 ◽  
pp. 314-318 ◽  
Author(s):  
Lechun Xie ◽  
Jiong Zhang ◽  
Cenbo Xiong ◽  
Lihong Wu ◽  
Chuanhai Jiang ◽  
...  
Keyword(s):  
Residual Stress ◽  
Surface Layer ◽  
Stress Distribution ◽  
Numerical Modelling ◽  
Shot Peening ◽  
Residual Stress Distribution

scholarly journals Microscopic Residual Stress Distribution Measurement on the Surface of Shot Peening

2014 ◽  
Vol 63 (9) ◽  
pp. 655-661 ◽  
Author(s):  
Shoichi YASUKAWA ◽  
Shinichi OHYA ◽  
Koichi TANGO ◽  
Kazuya TAKEDA ◽  
Akira TANGE
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Shot Peening ◽  
Residual Stress Distribution ◽  
Distribution Measurement

Measurement of Residual Stress Distribution of Ground Silicon Nitride by Glancing Incidence X-ray Diffraction Technique

1995 ◽  
Vol 39 ◽  
pp. 331-338
Author(s):  
Yoshihisa Sakaida ◽  
Keisuke Tanaka ◽  
Shintaro Harada
Keyword(s):  
Residual Stress ◽  
Surface Layer ◽  
Stress Distribution ◽  
Stress Measurement ◽  
Scintillation Counter ◽  
Ground Surface ◽  
Residual Stress Distribution ◽  
X Ray Diffraction ◽  
X Ray ◽  
Very High

A new method of X-ray stress measurement was proposed to estimate non-destructively the steep residual stress distribution in the surface layer of ground Si3N4. We assumed an exponential decrement of the residual stress near the ground surface, and derived a formula for the lattice strain as a function of sin2Ψ. In the experiments, the diffraction angles were measured on the ground surface for a widest possible range of sin2ѱ using an Ω-goniometer. In order to measure the diffraction angle at very high sin η values, a scintillation counter was located on the -η side and an incident X-ray beam impinged on the ground surface with a very low angle from the +η side using the glancing incidence X-ray diffraction technique. A strong non-linearity was found in the 20-sin2ѱ diagrams especially at very high ѱ -angles. From the analysis of non-linearity, the stress distribution in the surface layer was determined. Tine residual stress took the maximum compression of 2 GPa at a depth of about 0.5 μm from the surface, and then diminished to zero at about 25 μm in depth. In the close vicinity of the ground surface, the compressive residual stress was relieved because of both the surface roughness and microcracking induced during the grinding process.

scholarly journals Non-Destructive Method for Estimating Residual Stress Distribution in Component due to Shot Peening.

1999 ◽  
Vol 42 (2) ◽  
pp. 216-223 ◽  
Author(s):  
Toshio TERASAKI ◽  
Jun CHEN ◽  
Tetsuya AKIYAMA ◽  
Katsuhiko KISHITAKE
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Shot Peening ◽  
Residual Stress Distribution ◽  
Non Destructive

Numerical Simulation of Residual Stress Distribution Produced by Shot Peening

2011 ◽  
Vol 213 ◽  
pp. 339-343
Author(s):  
Yuan Song Zeng ◽  
Xia Huang ◽  
Li Juan Cao ◽  
Shou Ju Li
Keyword(s):  
Numerical Simulation ◽  
Residual Stress ◽  
Stress Distribution ◽  
Constitutive Model ◽  
Shot Peening ◽  
Target Material ◽  
Residual Stress Distribution ◽  
Plastic Behavior ◽  
Stress And Deformation ◽  
Residual Stress And Deformation

The shot peening process is largely used for the surface treatment and forming. The residual stress distribution developed within material may induce distortion of the component. The residual stress formed during the shot peening process is simulated numerically. The elastic-plastic constitutive model is adopted to describe the plastic behavior of the target material. The influence of shot peen speed on residual stress and deformation distribution is discussed.

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