Multi-scale indentation creep behavior in Fe-based amorphous/nanocrystalline coating at room temperature

2021 ◽  
Vol 283 ◽  
pp. 128768
Author(s):  
Anil Kumar ◽  
Sapan Kumar Nayak ◽  
Atanu Banerjee ◽  
Tapas Laha
Keyword(s):  
Creep Behavior ◽  
Room Temperature ◽  
Indentation Creep ◽  
Nanocrystalline Coating ◽  
Multi Scale

scholarly journals Indentation Creep Behavior in Ce-Based Bulk Metallic Glasses at Room Temperature

2005 ◽  
Vol 46 (12) ◽  
pp. 2959-2962 ◽  
Author(s):  
Bingchen Wei ◽  
Taihua Zhang ◽  
Weihuo Li ◽  
Dongmei Xing ◽  
Lingchen Zhang ◽  
...  
Keyword(s):  
Creep Behavior ◽  
Metallic Glasses ◽  
Room Temperature ◽  
Bulk Metallic Glasses ◽  
Indentation Creep

Influence of Solute Content and Secondary Phases on the Nano-Creep Behavior of Mg-Al-Ca Alloys

2007 ◽  
Vol 345-346 ◽  
pp. 605-608
Author(s):  
Li Hong Han ◽  
Derek O. Northwood ◽  
Henry Hu
Keyword(s):  
Creep Behavior ◽  
Room Temperature ◽  
Deformation Mechanisms ◽  
Indentation Creep ◽  
Secondary Phases ◽  
Creep Data ◽  
Solute Content ◽  
Eds Analysis ◽  
Diamond Indenter ◽  
Eds Microanalysis

Mg-Al-Ca alloys with 1wt.% and 2 wt.% Ca additions (AC51 and AC52) were cast by the Permanent Mold technique. The microstructures of the as-cast Mg-Al-Ca alloys were observed by SEM with EDS analysis. The secondary phases were mainly precipitated along the grain boundaries and exhibited a continuous network microstructure for the AC52 alloy and a divorced microstructure for the AC51 alloy. EDS microanalysis showed that the solute (Ca) content in the grains of the AC52 alloy is higher than that in the AC51. A three-sided pyramidal (Berkovich) diamond indenter was used to characterize the local nano-creep behavior at room temperature within the α-Mg in grains. The nano-creep results showed that the AC52 alloy has better creep resistance than the AC51 alloy at all loads at room temperature. The creep exponent n, obtained from the indentation creep data, changes from 6.3 to 3.0 for AC51 alloy and from 6.6 to 3.2 for AC52 alloy at a critical stress (132 MPa for the AC51 and 145 MPa for the AC52). The transition in creep behavior at higher stresses is associated with a change in the deformation mechanisms.

Compressive creep behavior of an electric brush-plated nanocrystalline Cu at room temperature

2009 ◽  
Vol 106 (8) ◽  
pp. 086105 ◽  
Author(s):  
Guoyong Wang ◽  
Jianshe Lian ◽  
Zhonghao Jiang ◽  
Liyuan Qin ◽  
Qing Jiang
Keyword(s):  
Creep Behavior ◽  
Room Temperature ◽  
Compressive Creep

Modeling of Nonlinear Viscoelastic Creep of Polycarbonate

e-Polymers ◽  
2007 ◽  
Vol 7 (1) ◽  
Author(s):  
Wenbo Luo ◽  
Said Jazouli ◽  
Toan Vu-Khanh
Keyword(s):  
Creep Behavior ◽  
Room Temperature ◽  
Multiple Integral ◽  
Model Fit ◽  
Viscoelastic Creep ◽  
Commercial Grade ◽  
Nonlinear Viscoelastic ◽  
Schapery Model ◽  
Special Case ◽  
Better Than

AbstractThe creep behavior of a commercial grade polycarbonate was investigated in this study. 10 different constant stresses ranging from 8 MPa to 50 MPa were applied to the specimen, and the resultant creep strains were measured at room temperature. It was found that the creep could be modeled linearly below 15 MPa, and nonlinearly above 15 MPa. Different nonlinear viscoelastic models have been briefly reviewed and used to fit the test data. It is shown that the Findley model is a special case of the Schapery model, and both the Findley model and the simplified multiple integral representation are suitable for properly describing the creep behavior of the polycarbonate investigated in this paper; however, the Findley model fit the data better than the simplified multiple integral with three terms.

Indentation Creep of Molybdenum: Comparison Between Thin Film and Bulk Material

1994 ◽  
Vol 356 ◽  
Author(s):  
K. B. Yoder ◽  
D. S. Stone ◽  
J. C. Lin ◽  
R. A. Hoffmann
Keyword(s):  
Thin Film ◽  
Grain Size ◽  
Room Temperature ◽  
Bulk Material ◽  
High Hardness ◽  
Rate Sensitivity ◽  
Indentation Creep ◽  
Creep Properties ◽  
Measurement Path ◽  
Arc Evaporation

AbstractIndentation creep, load relaxation, and rate-change experiments probe room temperature and 80°C creep properties of a 1.3 μm-thick molybdenum film on silicon. The film, with 0.51 GPa compressive stress, 8 GPa hardness and estimated 40 nm grain size, was deposited using steered-arc evaporation at -17V bias. Despite its small grain size and high hardness, the thin film behaves like bulk molybdenum does: the rate sensitivity of the hardness is only weakly-dependent on measurement path (as with bulk material), and activation volumes calculated based on strain rate sensitivity are consistent with those of bulk molybdenum We suspect deformation mechanisms are similar to those in bulk molybdenum under similar conditions.

scholarly journals Indentation Creep Behavior and Microstructure of Cu-Ge Ferrites

2011 ◽  
Vol 02 (08) ◽  
pp. 1076-1082 ◽  
Author(s):  
Hesham Mohaned Zaki ◽  
Ali Mohamed Abdel-Daiem ◽  
Yahia Ibrahim Swilem ◽  
Farid El-Tantawy ◽  
Fahad Masoud Al-Marzouki ◽  
...  
Keyword(s):  
Creep Behavior ◽  
Indentation Creep

Effect of hydrogen on creep behavior of Ti-6AI-4V alloy at room temperature

1991 ◽  
Vol 18 (6) ◽  
pp. 1125-1130 ◽  
Author(s):  
G. Y. Gao ◽  
S. C. Dexter
Keyword(s):  
Creep Behavior ◽  
Room Temperature

Characteristics of nanophase TiAl produced by inert gas condensation

1992 ◽  
Vol 7 (11) ◽  
pp. 2962-2970 ◽  
Author(s):  
H. Chang ◽  
C.J. Altstetter ◽  
R.S. Averback
Keyword(s):  
Electron Microscopy ◽  
Room Temperature ◽  
Large Fraction ◽  
Inert Gas ◽  
Full Density ◽  
Indentation Creep ◽  
Small Component ◽  
Grain Sizes ◽  
Transmission Electron ◽  
20 Nm

Nanophase TiAl, with grain sizes in the range of 10–20 nm, was synthesized by magnetron sputtering in an inert gas atmosphere and consolidated, in situ, under vacuum. The properties of the powders and sintered compacts were studied by transmission electron microscopy, scanning electron microscopy, calorimetry, Rutherford backscattering, and x-ray diffraction. Samples compacted at 1.0 GPa at room temperature had a large fraction of amorphous phase, while samples compacted at the same pressure and 250 °C were predominantly the equilibrium γ phase. An enthalpy change of 22 kJ/g-atom was measured during a DSC scan over the temperature range 125–450 °C, which is approximately the range over which crystallization occurs. Nearly full density could be achieved by sintering at 450 °C without significant, concomitant grain growth. The Vickers microhardness of these samples at room temperature and at −30 °C revealed an inverse Hall–Petch relationship at small grain sizes, 10–30 nm, and the usual Hall–Petch behavior at larger grain sizes. A small component of indentation creep was also observed. The maximum hardness is 4 times larger than that of a cast TiAl specimen of the same composition. The Vickers hardness was also observed to decrease rapidly with temperature above 200 °C.

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