Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect

2021 ◽  
pp. 103985
Author(s):  
Gesheng Xiao ◽  
Yuhong Ma ◽  
Xinkuo Ji ◽  
Tiejun Wang ◽  
Xuefeng Shu ◽  
...  
Keyword(s):  
High Temperature ◽  
Size Effect ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Micro Indentation

Plate-like cell growth during directional solidification of a Zn–20wt%Sn high-temperature lead-free solder alloy

2014 ◽  
Vol 182 ◽  
pp. 29-36 ◽  
Author(s):  
Washington L.R. Santos ◽  
Crystopher Brito ◽  
José M.V. Quaresma ◽  
José E. Spinelli ◽  
Amauri Garcia
Keyword(s):  
High Temperature ◽  
Cell Growth ◽  
Directional Solidification ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder
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