scholarly journals Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties

2019 ◽  
Vol 9 (3) ◽  
pp. 133-139
Author(s):  
Kohei MITSUI ◽  
Ikuo SHOHJI ◽  
Tatsuya KOBAYASHI ◽  
Hirohiko WATANABE
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

2015 ◽  
Vol 67 ◽  
pp. 209-216 ◽  
Author(s):  
Li Yang ◽  
Yaocheng Zhang ◽  
Jun Dai ◽  
Yanfeng Jing ◽  
Jinguo Ge ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Effective acquisition of elastoplastic and creep parameters of lead-free solder alloy from high-temperature micro-indentation eliminating the size effect

2021 ◽  
pp. 103985
Author(s):  
Gesheng Xiao ◽  
Yuhong Ma ◽  
Xinkuo Ji ◽  
Tiejun Wang ◽  
Xuefeng Shu ◽  
...  
Keyword(s):  
High Temperature ◽  
Size Effect ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Micro Indentation

Plate-like cell growth during directional solidification of a Zn–20wt%Sn high-temperature lead-free solder alloy

2014 ◽  
Vol 182 ◽  
pp. 29-36 ◽  
Author(s):  
Washington L.R. Santos ◽  
Crystopher Brito ◽  
José M.V. Quaresma ◽  
José E. Spinelli ◽  
Amauri Garcia
Keyword(s):  
High Temperature ◽  
Cell Growth ◽  
Directional Solidification ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

scholarly journals Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy.

2002 ◽  
Vol 5 (2) ◽  
pp. 152-158 ◽  
Author(s):  
Hisaaki TAKAO ◽  
Akira YAMADA ◽  
Hideo HASEGAWA ◽  
Masao MATSUI
Keyword(s):  
Mechanical Properties ◽  
Solder Joint ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Lead Free Solder Alloy ◽  
Free Solder

Effect of Gold Addition on the Microstructure and Mechanical Properties of Sn–3.8Ag–0.7Cu Lead-Free Solder Alloy

2018 ◽  
Vol 71 (6) ◽  
pp. 1497-1505 ◽  
Author(s):  
V. L. Niranjani ◽  
Pamidi Venkateswarlu ◽  
Vajinder Singh ◽  
B. S. S. Chandra Rao ◽  
S. V. Kamat
Keyword(s):  
Mechanical Properties ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Microstructure And Mechanical Properties ◽  
Lead Free Solder Alloy ◽  
Free Solder
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