Crack Tip Fields in a Fiber-reinforced Hyperelastic Sheet: Competing Roles of Fiber and Matrix Stiffening

Author(s):  
Yin LIU ◽  
Brian MORAN
2011 ◽  
Vol 19 (4-5) ◽  
pp. 401-404
Author(s):  
Dai Yao ◽  
Zhang Lei ◽  
Liu Jun-feng ◽  
Zhong Xiao

1975 ◽  
Vol 9 (3) ◽  
pp. 266-287 ◽  
Author(s):  
John F. Mandell ◽  
Su-Su Wang ◽  
Frederick J. Mcgarry

2005 ◽  
Vol 58 (1) ◽  
pp. 37-48 ◽  
Author(s):  
Alan T. Zehnder ◽  
Mark J. Viz

The fracture mechanics of plates and shells under membrane, bending, twisting, and shearing loads are reviewed, starting with the crack tip fields for plane stress, Kirchhoff, and Reissner theories. The energy release rate for each of these theories is calculated and is used to determine the relation between the Kirchhoff and Reissner theories for thin plates. For thicker plates, this relationship is explored using three-dimensional finite element analysis. The validity of the application of two-dimensional (plate theory) solutions to actual three-dimensional objects is analyzed and discussed. Crack tip fields in plates undergoing large deflection are analyzed using von Ka´rma´n theory. Solutions for cracked shells are discussed as well. A number of computational methods for determining stress intensity factors in plates and shells are discussed. Applications of these computational approaches to aircraft structures are examined. The relatively few experimental studies of fracture in plates under bending and twisting loads are also reviewed. There are 101 references cited in this article.


2014 ◽  
Vol 1015 ◽  
pp. 97-100
Author(s):  
Yao Dai ◽  
Xiao Chong ◽  
Ying Chen

The higher order crack-tip fields for an anti-plane crack situated in the interface between functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) are presented. The mechanical and electrical properties of the FGPMs are assumed to be linear functions of y perpendicular to the crack. The crack surfaces are supposed to be insulated electrically. By using the method of eigen-expansion, the higher order stress and electric displacement crack tip fields for FGPMs and HPMs are obtained. The analytic expressions of the stress intensity factors and the electric displacement intensity factors are derived.


1990 ◽  
Vol 57 (1) ◽  
pp. 40-49 ◽  
Author(s):  
F. Z. Li ◽  
J. Pan

Plane-strain crack-tip stress and strain fields are presented for materials exhibiting pressure-sensitive yielding and plastic volumetric deformation. The yield criterion is described by a linear combination of the effective stress and the hydrostatic stress, and the plastic dilatancy is introduced by the normality flow rule. The material hardening is assumed to follow a power-law relation. For small pressure sensitivity, the plane-strain mode I singular fields are found in a separable form similar to the HRR fields (Hutchinson, 1968a, b; Rice and Rosengren, 1968). The angular distributions of the fields depend on the material-hardening exponent and the pressure-sensitivity parameter. The low-hardening solutions for different degrees of pressure sensitivity are found to agree remarkably with the corresponding perfectly-plastic solutions. An important aspect of the effects of pressure-sensitive yielding and plastic dilatancy on the crack-tip fields is the lowering of the hydrostatic stress and the effective stress directly ahead of the crack tip, which may contribute to the experimentally-observed enhancement of fracture toughness in some ceramic and polymeric composite materials.


Sign in / Sign up

Export Citation Format

Share Document