Optimizing the precision of the four-point bend test for the measurement of thin film adhesion

2005 ◽  
Vol 82 (2) ◽  
pp. 99-112 ◽  
Author(s):  
R. Shaviv ◽  
S. Roham ◽  
P. Woytowitz
Keyword(s):  
Thin Film ◽  
Bend Test ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Point Bend Test ◽  
Point Bend ◽  
Four Point Bend Test

The Strength of the Silicon Die in Flip-Chip Assemblies

2003 ◽  
Vol 125 (1) ◽  
pp. 114-119 ◽  
Author(s):  
B. Cotterell ◽  
Z. Chen ◽  
J.-B. Han ◽  
N.-X. Tan
Keyword(s):  
Flip Chip ◽  
Surface Defects ◽  
Bend Test ◽  
Ring Test ◽  
Mechanical Reliability ◽  
Reliability Estimate ◽  
Edge Defects ◽  
Point Bend Test ◽  
Point Bend ◽  
Four Point Bend Test

The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it is the “strength” of the edge defects that dominate the reliability. However, if the edges of the die are only lightly stressed compared with the surface, edge defects are unlikely to cause fracture. In this case the use of the four-point-bend test, which is sensitive to both edge and surface defects, will result in an underestimate of the reliability and if only one test is to be performed the ring-on-ring test is preferable to the four-point-bend test. Generally, for a full reliability estimate, the distributions of both types of defect need to be determined.

Experimental study of WL-CSP reliability subjected to a four-point bend-test

2010 ◽  
Vol 50 (7) ◽  
pp. 1007-1013 ◽  
Author(s):  
Cédric Le Coq ◽  
Adellah Tougui ◽  
Marie-Pascale Stempin ◽  
Laurent Barreau
Keyword(s):  
Experimental Study ◽  
Bend Test ◽  
Point Bend Test ◽  
Point Bend ◽  
Four Point Bend Test

High yield four-point bend thin film adhesion testing techniques

2011 ◽  
Vol 78 (12) ◽  
pp. 2390-2398 ◽  
Author(s):  
Ryan P. Birringer ◽  
Paula J. Chidester ◽  
Reinhold H. Dauskardt
Keyword(s):  
Thin Film ◽  
High Yield ◽  
Adhesion Testing ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Testing Techniques ◽  
Point Bend

scholarly journals Design of a four-point bend test for ultra-low cycle fatigue of pipelines under inelastic bending

2012 ◽  
Vol 3 (1) ◽  
pp. 70-79
Author(s):  
Toon Muylaert ◽  
Wim De Waele
Keyword(s):  
Large Scale ◽  
Low Cycle Fatigue ◽  
Ductile Failure ◽  
Bend Test ◽  
Small Scale ◽  
Cycle Fatigue ◽  
Master Thesis ◽  
Point Bend Test ◽  
Point Bend ◽  
Four Point Bend Test

This master thesis is situated in the research domain dealing with the ductile failure of pipelinesunder extreme loading conditions. It is part of an umbrella research aiming to develop innovativeexperimental and computational methodologies to simulate fracture of steel structural elements under ultralow cycle fatigue. The focus of this study is on steel pipeline applications. The objective of this thesis is todesign a large-scale four-point bend test setup to cyclically bend pipes. The feasibility of instrumentationwill be evaluated using small scale test specimens. In this paper some ideas, constraints and opportunitiesfor the design are considered, based on a literature review of several test setups for other applications. Thedesign parameters have been calculated to compose the design windows and an initial overview of thepossible instrumentation is given.

Sign in / Sign up

Export Citation Format

Share Document