Comparison of fatigue life prediction methods for solder joints under random vibration loading

2019 ◽  
Vol 95 ◽  
pp. 58-64 ◽  
Author(s):  
Jiang Xia ◽  
Lin Yang ◽  
Qunxing Liu ◽  
Qi Peng ◽  
LanXian Cheng ◽  
...  
2000 ◽  
Author(s):  
T. E. Wong ◽  
F. W. Palmieri ◽  
L. A. Kachatorian

Abstract A newly developed methodology is used to support test validation of ball grid array (BGA) solder joint vibration fatigue life prediction model. This model is evolved from an empirical formula of universal slopes, which is derived from high-cycle fatigue test data using a curve fitting technique over 29 different materials of metals. To develop the BGA solder joint vibration fatigue life prediction model, a test vehicles (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed, fabricated and subjected to random vibration tests with continuously monitoring the solder joint integrity. Based on the measurement results, a destructive physical analysis is then conducted to further verify the failure locations and crack paths of the solder joints. Next, a method to determine the stresses/strains of BGA solder joints resulting from exposure of the TV to random vibration environments is developed. In this method, a 3-D modeling technique is used to simulate the vibration responses of the BGA packages. Linear static and dynamic finite element analyses with MSC/NASTRAN™ computer code, combined with a volume-weighted average technique, are conducted to calculate the effective strains of the solder joints. In the calculation process, several in-house developed Fortran programs, in conjunction with the outputs obtained from MSC/NASTRAN™ static and frequency response analyses, are used to perform the required computations. Finally, a vibration fatigue life model is established with two unknown parameters, which can be determined by correlating the derived solder effective strains to the test data. This test-calibrated model is then recommended to serve as an effective tool to determine the integrity of the BGA solder joints during vibration. Selecting more study cases with various package sizes, solder ball configurations, vibration profiles to further calibrate this model is also recommended. An example of a 313-pin plastic and 304-pin ceramic BGAs is illustrated in the present study.


2017 ◽  
Vol 71 ◽  
pp. 111-118 ◽  
Author(s):  
Jiang Xia ◽  
GuoYuan Li ◽  
Bin Li ◽  
LanXian Cheng ◽  
Bin Zhou

2011 ◽  
Vol 51 (3) ◽  
pp. 649-656 ◽  
Author(s):  
Da Yu ◽  
Abdullah Al-Yafawi ◽  
Tung T. Nguyen ◽  
Seungbae Park ◽  
Soonwan Chung

2015 ◽  
Vol 2015 ◽  
pp. 1-13 ◽  
Author(s):  
Yu Jiang ◽  
Gun Jin Yun ◽  
Li Zhao ◽  
Junyong Tao

Novel accelerated random vibration fatigue test methodology and strategy are proposed, which can generate a design of the experimental test plan significantly reducing the test time and the sample size. Based on theoretical analysis and fatigue damage model, several groups of random vibration fatigue tests were designed and conducted with the aim of investigating effects of both Gaussian and non-Gaussian random excitation on the vibration fatigue. First, stress responses at a weak point of a notched specimen structure were measured under different base random excitations. According to the measured stress responses, the structural fatigue lives corresponding to the different vibrational excitations were predicted by using the WAFO simulation technique. Second, a couple of destructive vibration fatigue tests were carried out to validate the accuracy of the WAFO fatigue life prediction method. After applying the proposed experimental and numerical simulation methods, various factors that affect the vibration fatigue life of structures were systematically studied, including root mean squares of acceleration, power spectral density, power spectral bandwidth, and kurtosis. The feasibility of WAFO for non-Gaussian vibration fatigue life prediction and the use of non-Gaussian vibration excitation for accelerated fatigue testing were experimentally verified.


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