2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
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332

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22

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9781424464104

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

3D interconnection process development and integration with low stress TSV

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490728 ◽

2010 ◽

Author(s):

T. T. Chua ◽

S. W. Ho ◽

H. Y. Li ◽

C. H. Khong ◽

E. B Liao ◽

...

Keyword(s):

Process Development

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Three chips stacking with low volume solder using single re-flow process

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490686 ◽

2010 ◽

Author(s):

Navas Khan ◽

David Ho Soon Wee ◽

Ong Siong Chiew ◽

Cheryl Sharmani ◽

Li Shiah Lim ◽

...

Keyword(s):

Flow Process ◽

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Application of the latency insertion method (LIM) to the modeling of CDM ESD events

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490800 ◽

2010 ◽

Author(s):

Dmitri Klokotov ◽

Vrashank Shukla ◽

Jose Schutt-Aine ◽

Elyse Rosenbaum

Keyword(s):

Insertion Method ◽

Latency Insertion

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Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490744 ◽

2010 ◽

Author(s):

G. Prashant Reddy ◽

P. Markondeya Raj ◽

Nikhilesh Nataraj ◽

P. M. Rajesh ◽

Gopal Jha ◽

...

Keyword(s):

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Challenges of Cu wire bonding on low-k/Cu wafers with BOA structures

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490949 ◽

2010 ◽

Author(s):

Chu-Chung Lee ◽

Leo M Higgins

Keyword(s):

Wire Bonding ◽

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Design and fabrication of a reliability test chip for 3D-TSV

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490889 ◽

2010 ◽

Author(s):

A D Trigg ◽

Li Hong Yu ◽

Xiaowu Zhang ◽

Chai Tai Chong ◽

Cheng Cheng Kuo ◽

...

Keyword(s):

Reliability Test ◽

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A novel die to wafer (D2W) collective bonding method for MEMS and electronics heterogeneous 3D integration

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490721 ◽

2010 ◽

Author(s):

Won Kyoung Choi ◽

C. S. Premachandran ◽

Ling Xie ◽

Siong Chiew Ong ◽

Johnny Han He ◽

...

Keyword(s):

3D Integration ◽

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Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490637 ◽

2010 ◽

Author(s):

K. Zoschke ◽

M. Wegner ◽

M. Wilke ◽

N. Jurgensen ◽

C. Lopper ◽

...

Keyword(s):

System Integration ◽

Key Technology ◽

Handling System ◽

Wafer Processing

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Design of wideband bandpass filters using Si-BCB technology for millimeter-wave applications

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490922 ◽

2010 ◽

Author(s):

Rui Li ◽

Teck Guan Lim ◽

Soon Wee Ho ◽

Yong Zhong Xiong ◽

Damaruganath Pinjala

Keyword(s):

Millimeter Wave ◽

Bandpass Filters

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Characterization of ICA attachment of SMD on inkjet-printed substrates

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490822 ◽

2010 ◽

Author(s):

Juha Niittynen ◽

Ville Pekkanen ◽

Matti Mantysalo

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