High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Author(s):  
Adwait Inamdar ◽  
Yu-Hsiang Yang ◽  
Alexandru Prisacaru ◽  
Przemyslaw Gromala ◽  
Bongtae Han
2019 ◽  
Vol 150 ◽  
pp. 166-173
Author(s):  
Sergey Yu. Kondrat'ev ◽  
Grigoriy P. Anastasiadi ◽  
Alina V. Ptashnik ◽  
Sergey N. Petrov

2014 ◽  
Vol 601 ◽  
pp. 57-62 ◽  
Author(s):  
Sumei Zhao ◽  
Yu Zhao ◽  
Binglin Zou ◽  
Xizhi Fan ◽  
Jiaying Xu ◽  
...  

2001 ◽  
Vol 27 (1) ◽  
pp. 77-80 ◽  
Author(s):  
A. M. Orlov ◽  
A. A. Skvortsov ◽  
A. G. Klement’ev ◽  
A. V. Sindyaev

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