High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package
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2017 ◽
Vol 47
(4)
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pp. 2488-2498
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2021 ◽
Keyword(s):
2014 ◽
Vol 601
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pp. 57-62
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Keyword(s):
Keyword(s):
1976 ◽
Vol 62
(8)
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pp. 981-990
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1972 ◽
Vol 10
(10)
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pp. 2967-2982
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