Ordered stacking of oriented BN in confined space to construct effective heat transfer pathways

Polymer ◽  
2021 ◽  
pp. 124300
Author(s):  
Shuai Liu ◽  
Hong Wu ◽  
Shaoyun Guo ◽  
Jianhui Qiu
2017 ◽  
Vol 118 ◽  
pp. 188-198 ◽  
Author(s):  
Yongsheng Tian ◽  
Keyuan Zhang ◽  
Naihua Wang ◽  
Zheng Cui ◽  
Lin Cheng

Author(s):  
Chien-Yuh Yang ◽  
Chien-Fu Liu

Numerous researches have been developed for pool boiling on microporous coated surface in the past decade. The nucleate boiling heat transfer was found to be increased by up to 4.5 times than that on uncoated surface. Recently, the two-phase micro heat exchangers have been considered for high flux electronic devices cooling. The enhancement techniques for improving the nucleate boiling heat transfer performance in the micro heat exchangers have gotten more importance. Previous studies of microporous coatings, however, have been restricted to boiling in unconfined space. No studies have been made on the feasibility of using microporous coatings for enhancing boiling in confined spaces. This study provides an experimental observation of the vapor generation and leaving processes on microporous coatings surface in a 1-mm confined space. It would be helpful for understanding the mechanism of boiling heat transfer and improving the design of two-phase micro heat exchangers. Aluminum particles of average diameter 20 μm were mixed with a binder and a carrier to develop a 150 μm thickness boiling enhancement paint on a 3.0 cm by 3.0 cm copper heating surface. The heating surface was covered by a thin glass plate with a 1 mm spacer to form a 1 mm vertical narrow space for the test section. The boiling phenomenon was recorded by a high speed camera. In addition to the three boiling regimes observed by Bonjour and Lallemand [1], i.e., isolated deformed bubbles, coalesced bubbles and partial dryout at low, moderate and high heat fluxes respectively in unconfined space, a suction and blowing process was observed at the highest heat flux condition. Owing to the space confinement, liquid was sucked and vapor was expelled periodically during the bubble generation process. This mechanism significantly enhanced the boiling heat transfer performance in confined space.


2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Bharath Ramakrishnan ◽  
Yaser Hadad ◽  
Sami Alkharabsheh ◽  
Paul R. Chiarot ◽  
Bahgat Sammakia

Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of microelectronic devices and an increasing demand for clock speed result in high heat flux systems. By adopting direct liquid cooling, the high heat flux and high power demands can be met, while the reliability of the electronic devices is greatly improved. Cold plates which are mounted directly on to the chips facilitate a lower thermal resistance path originating from the chip to the incoming coolant. An attempt was made in the current study to characterize a commercially available cold plate which uses warm water in carrying the heat away from the chip. A mock package mimicking a processor chip with an effective heat transfer area of 6.45 cm2 was developed for this study using a copper block heater arrangement. The thermo-hydraulic performance of the cold plates was investigated by conducting experiments at varying chip power, coolant flow rates, and coolant temperature. The pressure drop (ΔP) and the temperature rise (ΔT) across the cold plates were measured, and the results were presented as flow resistance and thermal resistance curves. A maximum heat flux of 31 W/cm2 was dissipated at a flow rate of 13 cm3/s. A resistance network model was used to calculate an effective heat transfer coefficient by revealing different elements contributing to the total resistance. The study extended to different coolant temperatures ranging from 25 °C to 45 °C addresses the effect of coolant viscosity on the overall performance of the cold plate, and the results were presented as coefficient of performance (COP) curves. A numerical model developed using 6SigmaET was validated against the experimental findings for the flow and thermal performance with minimal percentage difference.


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