Evaluation of postharvest treatments with chemical resistance inducers to control green and blue molds on orange fruit

2013 ◽  
Vol 85 ◽  
pp. 132-135 ◽  
Author(s):  
Pedro A. Moscoso-Ramírez ◽  
Lluís Palou
Keyword(s):  
Chemical Resistance ◽  
Postharvest Treatments ◽  
Orange Fruit ◽  
Resistance Inducers

scholarly journals Evaluation of chemical resistance inducers in maradol papaya against Phytophthora nicotianae var. parasitica

2021 ◽  
Author(s):  
Carlos Fredy Ortiz garcía ◽  
Rebeca Rodríguez-Falconi ◽  
Pedro A. Moscoso-Ramírez ◽  
Luz del C. Lagunez-Espinoza ◽  
Francisco Osorio-Acosta
Keyword(s):  
Design Methodology ◽  
Chemical Resistance ◽  
Positive Control ◽  
Phytophthora Nicotianae ◽  
Single Application ◽  
Chemical Inducers ◽  
Randomized Design ◽  
Repeated Use ◽  
Resistance Inducers ◽  
Experimental Plots

Objective: To test the efficiency of four chemical resistance inducers on Maradol papaya to reduce Phytopthora nicotianae var. parasitica infections in rainfed crops at Chontalpa, Tabasco, Mexico. Design/methodology/approach: Three doses of four resistance inducers were tested on 60-day-old papaya plants in a greenhouse with a randomized design, with four replications and 10 plants as experimental plots.  Three days after the inducers' application inoculations with mycelium discs were made, there were negative and positive control treatments to evaluating their efficiency by applying Abbott's formula. Results: The four chemical inducers for resistance (sodium silicate (SS), potassium silicate (PS), potassium phosphite (PF) and acibenzolar-s-methyl (ASM)) were statistically different from the control (P < 0.0001**). The inducers SS 1 %, PS 1 %, FP 0.35 % and ASM 0.1 mM showed higher effectiveness (81.2, 75.9, 74.7 and 74.0 %). Study limitations/implications: The retained effective concentrations were tested in a single application, and their durability is unknown, so this point should be broadened. however, it may be an alternative for repeated use after transplanting. Findings/conclusions: Optimal concentrations of SS, PS, FP, and AMS, that respond against P. nicotianae var. parasitica infections can reduce damages in rainfed crops.

Efficacy of combined applications of antagonist bacteria and chemical resistance inducers for the management ofFusarium solanicausing root rot inWithania somnifera

2013 ◽  
Vol 23 (2) ◽  
pp. 239-244 ◽  
Author(s):  
Nidhi Bharti ◽  
Purvi Agrawal ◽  
Bishal Misra ◽  
Arpita Tripathi ◽  
Rakshpal Singh ◽  
...  
Keyword(s):  
Root Rot ◽  
Chemical Resistance ◽  
Resistance Inducers

Surface Modification of Poly (alkyl/Arylphosphazene) Thin Films

2000 ◽  
Vol 629 ◽  
Author(s):  
John V. St. John ◽  
Patty Wisian-Neilson
Keyword(s):  
Thin Films ◽  
Surface Modification ◽  
Chemical Resistance ◽  
Chemical Properties ◽  
Inorganic Polymers ◽  
Thin Polymer Films ◽  
Hydrophilic Interactions ◽  
Carboxylic Acid Groups ◽  
Polymer Interface ◽  
Thin Polymer

ABSTRACTPoly (methylphenylphosphazene) (PMPP) is an example of a unique class of inorganic polymers with alternating – (P=N)– backbones. Chemical modification of bulk PMPP can result in changes of physical properties such as chemical resistance, onset temperature of thermal degradation, elasticity, and flexibility. Surface modification of PMPP allows tailoring of the chemical properties at the polymer interface while maintaining the integrity of the bulk polymer. In this research, PMPP thin films were treated to form carboxylate or carboxylic acid groups at the surface. Surface modification was monitored by following changes in contact angle. The hydrophobic/hydrophilic interactions of carboxylated PMPP surfaces allow for mesoscale interactions of thin polymer films.

Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package

2018 ◽  
Author(s):  
Ong Pei Hoon ◽  
Ng Kiong Kay ◽  
Gwee Hoon Yen
Keyword(s):  
Failure Analysis ◽  
Chemical Etching ◽  
Chemical Resistance ◽  
Etching Time ◽  
Lead Frame ◽  
Front Side ◽  
Electrical Measurements ◽  
Mechanical Preparation ◽  
Die Surface ◽  
Copper Lead

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.

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