Characterization of nano precipitate phase in an as-extruded Zn-Cu alloy

2021 ◽  
Vol 200 ◽  
pp. 113907
Author(s):  
Jimiao Jiang ◽  
Hua Huang ◽  
Jialin Niu ◽  
Zhaohui Jin ◽  
Matthew Dargusch ◽  
...  
Keyword(s):  
Precipitate Phase ◽  
Cu Alloy

Microstructural Characterization of an Al-Li-Mg-Cu Alloy by Correlative Electron Tomography and Atom Probe Tomography

2014 ◽  
Vol 20 (4) ◽  
pp. 1022-1028 ◽  
Author(s):  
Xiangyuan Xiong ◽  
Matthew Weyland
Keyword(s):  
Atom Probe Tomography ◽  
Electron Tomography ◽  
Microstructural Characterization ◽  
Atom Probe ◽  
Precipitate Phase ◽  
Cu Alloy ◽  
Geometric Reconstruction ◽  
Tomography Data ◽  
Strong Agreement

AbstractCorrelative electron tomography and atom probe tomography have been carried out successfully on the same region of a commercial 8090 aluminum alloy (Al-Li-Mg-Cu). The combination of the two techniques allows accurate geometric reconstruction of the atom probe tomography data verified by crystallographic information retrieved from the reconstruction. Quantitative analysis of the precipitate phase compositions and volume fractions of each phase have been obtained from the atom probe tomography and electron tomography at various scales, showing strong agreement between both techniques.

Stability and Microstructure Characterization of Barrierless Cu (Sn, C) Films

2014 ◽  
Vol 1052 ◽  
pp. 163-168 ◽  
Author(s):  
Xiao Na Li ◽  
Lu Jie Jin ◽  
Li Rong Zhao ◽  
Chuang Dong
Keyword(s):  
Diffusion Barrier ◽  
Amorphous Layer ◽  
Barrier Effect ◽  
Co Doping ◽  
Cu Alloy ◽  
Large Atom ◽  
Cu Film ◽  
Small Atom ◽  
Lower Resistivity

Thermal stability, adhesion and electronic resistivity of the Cu alloy films with diffusion barrier elements (large atom Sn and small atom C) have been studied. Ternary Cu (0.6 at.% Sn, 2 at.% C) films were prepared by magnetron co-sputtering in this work. The microstructure and resistivity analysis on the films showed that the Cu (0.6 at.% Sn, 2 at.% C) film had better adhesion with the substrate and lower resistivity (2.8 μΩ·cm, after annealing at 600 °C for 1 h). Therefore, the doping of carbon atoms makes less effect to the resistivity by decreasing the amount of the doped large atoms, which results in the decreasing of the whole resistivity of the barrierless structure. After annealing, the doped elements in the film diffused to the interface to form self-passivated amorphous layer, which could further hinder the diffusion between Cu and Si. So thus ternary Cu (0.6 at.% Sn, 2 at.% C) film had better diffusion barrier effect. Co-doping of large atoms and small atoms in the Cu film is a promising way to improve the barrierless structure.

Microstructure characterization of phase transformations in a Zn–22 wt%Al–2 wt%Cu alloy by XRD, SEM, TEM and FIM

2000 ◽  
Vol 313 (1-2) ◽  
pp. 154-160 ◽  
Author(s):  
Héctor J. Dorantes-Rosales ◽  
Vı́ctor M. López-Hirata ◽  
José L. Méndez-Velázquez ◽  
Maribel L. Saucedo-Muñoz ◽  
David Hernández-Silva
Keyword(s):  
Phase Transformations ◽  
Microstructure Characterization ◽  
Cu Alloy

Fabrication and Characterization of Targets for Shock Propagation and Radiation Burnthrough Measurements on Be-0.9 AT. % Cu Alloy

2004 ◽  
Vol 45 (2) ◽  
pp. 127-136 ◽  
Author(s):  
A. Nobile ◽  
S. C. Dropinski ◽  
J. M. Edwards ◽  
G. Rivera ◽  
R. W. Margevicius ◽  
...  
Keyword(s):  
Shock Propagation ◽  
Cu Alloy ◽  
Fabrication And Characterization

Preparation and characterization of agar-based nanocomposite films reinforced with bimetallic (Ag-Cu) alloy nanoparticles

2017 ◽  
Vol 155 ◽  
pp. 382-390 ◽  
Author(s):  
Yasir Ali Arfat ◽  
Jasim Ahmed ◽  
Harsha Jacob
Keyword(s):  
Nanocomposite Films ◽  
Alloy Nanoparticles ◽  
Cu Alloy

Three-dimensional characterization of superplastic grain boundary sliding inside Al–Zn–Mg–Cu alloy sheet

2019 ◽  
Vol 164 ◽  
pp. 82-85 ◽  
Author(s):  
Hiroshi Masuda ◽  
Hirobumi Tobe ◽  
Toru Hara ◽  
Eiichi Sato
Keyword(s):  
Grain Boundary ◽  
Three Dimensional ◽  
Grain Boundary Sliding ◽  
Alloy Sheet ◽  
Cu Alloy ◽  
Boundary Sliding

Characterization of Precipitation Evolution in a Zn-Added Al-Mg-Si-Cu Alloy during Artificial Aging at 170 °C

2018 ◽  
Vol 941 ◽  
pp. 961-966
Author(s):  
Shang Zhu ◽  
Zhi Hui Li ◽  
Li Zhen Yan ◽  
Xi Wu Li ◽  
Shu Hui Huang ◽  
...  
Keyword(s):  
Artificial Aging ◽  
Age Hardening ◽  
Peak Hardness ◽  
Aging Condition ◽  
Β Phase ◽  
Cu Alloy ◽  
Zn Concentration ◽  
The Matrix ◽  
Small Clusters

A Zn-added Al-Mg-Si-Cu alloy during aging at 170 °C up to 34 h exhibits an interesting age-hardening effect. Small clusters, enriched in Mg and Si, are present in the sample after 0.25 h aging. The β′′ phase is dominant with the peak hardness of 135 HV after aging of 8 h. A decrease in hardness of the alloy occurs with the aging time increasing to 34 h, due to the coarsening of β′′ phase. It is also found that the Cu-containing L phase co-exists with the β′′ phase at this aging condition. The quantitative solute concentrations of the matrix show that the formation of clusters is consistent with the slight lower contents of Mg, Si and Cu compared with the alloy chemical composition, and the present of β′′ and L phase is associated with the further partitioning of Mg, Si and Cu from the Al matrix into the precipitates. No Zn-rich clusters and precipitates are observed and the Zn concentration in matrix has no significant change during aging for up to 34 h. This result means that the major of Zn remains in the matrix as aging continues.

Characterization of suitable buffer layers on Cu and Cu–alloy metal substrates for the development of coated conductors

2004 ◽  
Vol 17 (5) ◽  
pp. S341-S344 ◽  
Author(s):  
C Cantoni ◽  
D K Christen ◽  
E D Specht ◽  
M Varela ◽  
J R Thompson ◽  
...  
Keyword(s):  
Coated Conductors ◽  
Buffer Layers ◽  
Metal Substrates ◽  
Cu Alloy ◽  
Alloy Metal

X-ray diffraction characterization of the decomposition behavior of γMn phase in a Mn-30at.%Cu alloy

1999 ◽  
Vol 40 (9) ◽  
pp. 993-998 ◽  
Author(s):  
Fuxing Yin ◽  
Yoshiaki Ohsawa ◽  
Akira Sato ◽  
Kohji Kawahara
Keyword(s):  
X Ray Diffraction ◽  
X Ray ◽  
Cu Alloy ◽  
Decomposition Behavior
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