scholarly journals Root cause analysis underscores the importance of understanding, addressing, and communicating cold chain equipment failures to improve equipment performance

Vaccine ◽  
2017 ◽  
Vol 35 (17) ◽  
pp. 2198-2202 ◽  
Author(s):  
Pat Lennon ◽  
Brian Atuhaire ◽  
Shahrzad Yavari ◽  
Vidya Sampath ◽  
Mercy Mvundura ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cold Chain ◽  
Cause Analysis ◽  
Root Cause ◽  
Equipment Failures ◽  
Equipment Performance

scholarly journals ANALISIS PENYEBAB PENOLAKAN PRODUK PERIKANAN INDONESIA OLEH UNI EROPA PERIODE 2007 – 2017 DENGAN PENDEKATAN ROOT CAUSE ANALYSIS

2019 ◽  
Vol 21 (2) ◽  
pp. 149
Author(s):  
Heny Irawati ◽  
Feri Kusnandar ◽  
Harsi D Kusumaningrum
Keyword(s):  
Hazard Analysis ◽  
Control Point ◽  
Root Cause Analysis ◽  
Cold Chain ◽  
Cause Analysis ◽  
Chain System ◽  
Critical Control Point ◽  
Root Cause

<p>Produk perikanan yang diekspor ke Uni Eropa dipersyaratkan untuk diproduksi dari Unit Pengolahan Ikan (UPI) yang telah mempunyai sertifikat penerapan <em>Hazard Analysis and Critical Control Point</em> (HACCP) Grade A. Beberapa kasus penolakan oleh negara pengimpor masih terjadi dengan alasan ditemukannya cemaran mikrobiologi dan kimia yang melebihi ambang batas standar Uni Eropa. Tujuan penelitian ini adalah untuk mengidentifikasi penyebab penolakan dan faktor utama yang berpengaruh sebagai penyebab kasus penolakan tersebut dengan menggunakan pendekatan <em>Root Cause Analysis </em>(RCA). Data yang digunakan adalah data penolakan produk perikanan yang diekspor ke Uni Eropa selama periode 2007-2017. Hasil analisis menunjukkan bahwa penyebab utama penolakan produk perikanan Indonesia utama adalah cemaran merkuri (33 kasus) dan cemaran histamin (16 kasus). Cemaran merkuri terjadi oleh pencemaran lingkungan perairan oleh limbah industri yang menggunakan merkuri dan frekuensi monitoring di setiap rantai proses yang kurang memadai. Cemaran histamin terjadi karena kurangnya pengetahuan nelayan dan pelaku usaha di tingkat produsen primer dalam hal cara penanganan ikan yang baik dan masih belum tercapainya penerapan <em>cold chain system </em>yang baik pada rantai proses.</p>

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

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