In situ and ex situ diagnostics on melting and resolidification dynamics of amorphous and polycrystalline silicon thin films during excimer laser annealing

2000 ◽  
Vol 266-269 ◽  
pp. 654-658 ◽  
Author(s):  
Mutsuko Hatano ◽  
Seungjae Moon ◽  
Minghong Lee ◽  
Kenkichi Suzuki ◽  
Costas P Grigoropoulos
2006 ◽  
Vol 48 ◽  
pp. 937-944 ◽  
Author(s):  
Chil-Chyuan Kuo ◽  
Wen-Chang Yeh ◽  
Ji-Feng Lee ◽  
Jeng-Ywan Jeng1

2002 ◽  
Vol 46 (8) ◽  
pp. 1085-1090 ◽  
Author(s):  
Chang-Ho Tseng ◽  
Ching-Wei Lin ◽  
Teh-Hung Teng ◽  
Ting-Kuo Chang ◽  
Huang-Chung Cheng ◽  
...  

2013 ◽  
Vol 210 (12) ◽  
pp. 2729-2735 ◽  
Author(s):  
Ingmar Höger ◽  
Thomas Schmidt ◽  
Anja Landgraf ◽  
Martin Schade ◽  
Annett Gawlik ◽  
...  

2006 ◽  
Vol 45 (5B) ◽  
pp. 4344-4346 ◽  
Author(s):  
Shinji Munetoh ◽  
Takahide Kuranaga ◽  
Byoung Min Lee ◽  
Teruaki Motooka ◽  
Takahiko Endo ◽  
...  

2006 ◽  
Vol 958 ◽  
Author(s):  
Shinji Munetoh ◽  
Takanori Mitani ◽  
Takahide Kuranaga ◽  
Teruaki Motooka

ABSTRACTWe have performed molecular-dynamics simulations of heating, melting and recrystallization processes in amorphous silicon (a-Si) thin films deposited on glass during excimer laser annealing. By partially heating the a-Si surface region with 2 nm depth and removing thermal energy from the bottom of the glass substrate, a steady-state temperature profile was obtained in the a-Si layer with the thickness of 15 nm and only the surface region was melted. It was found that nucleation predominantly occurred in the a-Si region as judged by the coordination numbers and diffusion constants of atoms in the region. The results suggest that nucleation occurs in unmelted residual a-Si region during the laser irradiation and then crystal growth proceeds toward liquid Si region under the near-complete melting condition.


2006 ◽  
Vol 326-328 ◽  
pp. 195-198
Author(s):  
Seung Jae Moon

The formation and growth mechanism of polysilicon grains in thin films via laser annealing of amorphous silicon thin films are studied. The complete understanding of the mechanism is crucial to improve the thin film transistors used as switches in the active matrix liquid crystal displays. To understand the recrystallization mechanism, the temperature history and liquidsolid interface motion during the excimer laser annealing of 50-nm thick amorphous and polysilicon films on fused quartz substrates are intensively investigated via in-situ time-resolved thermal emission measurements, optical reflectance and transmittance measurements at near infrared wavelengths. The front transmissivity and reflectivity are measured to obtain the emissivity at the 1.52 μm wavelength of the probe IRHeNe laser to improve the accuracy of the temperature measurement. The melting point of amorphous silicon is higher than that of crystalline silicon of 1685 K by 100-150 K. This is the first direct measurement of the melting temperature of amorphous silicon thin films. It is found that melting of polysilicon occurs close to the melting point of crystalline silicon. Also the optical properties such as reflectance and transmittance are used to determine the melt duration by the detecting the difference of the optical properties of liquid silicon and solid silicon.


1999 ◽  
Author(s):  
Seung-Jae Moon ◽  
Ming-Hong Lee ◽  
Mutsuko Hatano ◽  
Kenkichi Suzuki ◽  
Constantine P. Grigoropoulos

Sign in / Sign up

Export Citation Format

Share Document