“Sers Activity” of Coldly Deposited Ag and Cu Films Quenched by Oxygen

1986 ◽  
pp. 113-122
Author(s):  
O. Ertork ◽  
C. Pettenkofer ◽  
A. Otto
Keyword(s):  
Cu Films

Precipitation in Al + 4% Cu Epitaxial Films

1968 ◽  
Vol 26 ◽  
pp. 384-385
Author(s):  
S. Herd ◽  
S. M. Mader
Keyword(s):  
Solid Solution ◽  
Bulk Material ◽  
Epitaxial Films ◽  
Detectable Change ◽  
Cu Films ◽  
Solution Treated ◽  
Single Crystal Films ◽  
Crystal Films ◽  
Diffraction Patterns ◽  
Deposited Films

Single crystal films in (001) orientation, about 1500 Å thick, were produced by R-F sputtering of Al + 4 wt % Cu onto cleaved KCl at 150°C substrate temperature. The as-deposited films contained numerous θ-CuAl2 particles (C16 structure) about 0.1μ in size. They were transferred onto Mo screens, solution treated and rapidly cooled (within about ½ min) so as to retain a homogeneous solid solution. Subsequently, the films were aged in vacuum at various temperatures in order to induce precipitation and to compare structures and morphologies of precipitate particles in Al-Cu films with those found in age hardened bulk material.Aging for 3 weeks at 60°C or 48 hrs at 100°C did not produce any detectable change in high resolution micrographs or diffraction patterns. In this range Guinier-Preston zones (GP) form in quenched bulk material. The absence of GP in the present experiments in this aging range is perhaps due to the cooling rate employed, which might be more equivalent to an aged and reverted bulk material than to a quenched one.

Some Properties and Structural Features of Poly(Vinyl Chloride)/Cu Films with Copper Nanoparticles Obtained by Exploding Wire Methodu

2020 ◽  
Vol 12 (4) ◽  
pp. 04032-1-04032-5
Author(s):  
V. V. Krivtsov ◽  
◽  
V. V. Kukla ◽  
V. V. Krivtsov ◽  
A. I. Shidlovskiy ◽  
...  
Keyword(s):  
Vinyl Chloride ◽  
Copper Nanoparticles ◽  
Structural Features ◽  
Exploding Wire ◽  
Cu Films ◽  
Poly Vinyl Chloride

scholarly journals Growth of TiO2/Cu films by HiPIMS for accelerated bacterial loss of viability

2013 ◽  
Vol 232 ◽  
pp. 804-813 ◽  
Author(s):  
Sami Rtimi ◽  
Oualid Baghriche ◽  
Cesar Pulgarin ◽  
Jean-Claude Lavanchy ◽  
John Kiwi
Keyword(s):  
Cu Films

Recrystallization-induced void migration in electroplated Cu films

2012 ◽  
Vol 67 (4) ◽  
pp. 312-315 ◽  
Author(s):  
Sunghwan Kim ◽  
Jin Yu
Keyword(s):  
Cu Films ◽  
Void Migration
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