Reactive ion etching with end point detection of microstructured Mo/Si multilayers by optical emission spectroscopy

2000 ◽  
Vol 54 (3-4) ◽  
pp. 303-314 ◽  
Author(s):  
L. Dreeskornfeld ◽  
R. Segler ◽  
G. Haindl ◽  
O. Wehmeyer ◽  
S. Rahn ◽  
...  
1997 ◽  
Vol 502 ◽  
Author(s):  
K. Min ◽  
J. J. Chambers ◽  
G. N. Parsons ◽  
J. R. Hauser

ABSTRACTSelective etch of SiO2/poly Si in a high density CF4+D2 plasma generated by ECR (Electron Cyclotron Resonance) system was studied. The end point detection of the SiO2 sidewall spacer etch was monitored using optical emission spectroscopy and mass spectrometer. SEM cross sectional analysis was conducted to confirm the end point detection and spacer formation.


2001 ◽  
Vol 82 (1-3) ◽  
pp. 159-162 ◽  
Author(s):  
H.S. Kim ◽  
Y.J. Sung ◽  
D.W. Kim ◽  
T. Kim ◽  
M.D. Dawson ◽  
...  

2001 ◽  
Vol 40 (Part 1, No. 3A) ◽  
pp. 1457-1462 ◽  
Author(s):  
Masaaki Kanoh ◽  
Masashi Yamage ◽  
Hiroyuki Takada

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