Utilization of Optical Emission Spectroscopy for End-Point Detection during AlGaAs/GaAs and InGaP/GaAs Etching in BCl[sub 3]/N[sub 2] Inductively Coupled Plasmas

2001 ◽  
Vol 148 (9) ◽  
pp. G472
Author(s):  
J. W. Lee ◽  
M. H. Jeon ◽  
G. S. Cho ◽  
H. C. Yim ◽  
S. K. Chang ◽  
...  
1997 ◽  
Vol 502 ◽  
Author(s):  
K. Min ◽  
J. J. Chambers ◽  
G. N. Parsons ◽  
J. R. Hauser

ABSTRACTSelective etch of SiO2/poly Si in a high density CF4+D2 plasma generated by ECR (Electron Cyclotron Resonance) system was studied. The end point detection of the SiO2 sidewall spacer etch was monitored using optical emission spectroscopy and mass spectrometer. SEM cross sectional analysis was conducted to confirm the end point detection and spacer formation.


2001 ◽  
Vol 82 (1-3) ◽  
pp. 159-162 ◽  
Author(s):  
H.S. Kim ◽  
Y.J. Sung ◽  
D.W. Kim ◽  
T. Kim ◽  
M.D. Dawson ◽  
...  

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