Surface chemical state analysis of electroplated Cu film under Cu-CMP process by means of TOF–SIMS

2003 ◽  
Vol 203-204 ◽  
pp. 473-477 ◽  
Author(s):  
H. Miyoshi ◽  
R. Saito ◽  
M. Kudo
2007 ◽  
Vol 129 (30) ◽  
pp. 9429-9438 ◽  
Author(s):  
Chi-Ying Lee ◽  
Gregory M. Harbers ◽  
David W. Grainger ◽  
Lara J. Gamble ◽  
David G. Castner

2015 ◽  
Vol 326 ◽  
pp. 151-161 ◽  
Author(s):  
Jonas Baltrusaitis ◽  
Beatriz Mendoza-Sanchez ◽  
Vincent Fernandez ◽  
Rick Veenstra ◽  
Nijole Dukstiene ◽  
...  

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