Microstructure evolution accompanying high temperature; uniaxial tensile creep of self-reinforced silicon nitride ceramics

1999 ◽  
Vol 272 (2) ◽  
pp. 380-388 ◽  
Author(s):  
Q Wei ◽  
J Sankar ◽  
A.D Kelkar ◽  
J Narayan
Keyword(s):  
High Temperature ◽  
Silicon Nitride ◽  
Microstructure Evolution ◽  
Tensile Creep ◽  
Uniaxial Tensile ◽  
Nitride Ceramics ◽  
Uniaxial Tensile Creep

scholarly journals Crack Healing Behaviour and High Temperature Strength of Silicon Nitride Ceramics.

1999 ◽  
Vol 65 (633) ◽  
pp. 1132-1139 ◽  
Author(s):  
Kotoji ANDO ◽  
MinCheol CHU ◽  
Yasuyoshi KOBAYASHI ◽  
Feiyuan YAO ◽  
Shigemi SATO
Keyword(s):  
High Temperature ◽  
Silicon Nitride ◽  
High Temperature Strength ◽  
Crack Healing ◽  
Nitride Ceramics

Effect of β-Si3N4 Powder on Thermal Conductivity of Silicon Nitride Ceramics

2015 ◽  
Vol 655 ◽  
pp. 11-16 ◽  
Author(s):  
Xing Li Liu ◽  
Meng Meng Peng ◽  
Xiao Shan Ning ◽  
Yosuke Takahashi
Keyword(s):  
Thermal Conductivity ◽  
Heat Treatment ◽  
High Temperature ◽  
Silicon Nitride ◽  
High Temperature Heat Treatment ◽  
Plasma Sintering ◽  
Nitride Ceramics ◽  
Temperature Heat ◽  
Spark Plasma ◽  
Temperature Heat Treatment

To investigate the influence of β-Si3N4 powder on thermal conductivity of silicon nitride, coarse, fine β-Si3N4 powder and various β-Si3N4/α-Si3N4 ratios of starting powders were adopted to fabricate ceramics by spark plasma sintering at 1600°Cand subsequent high-temperature heat treatment at 1900°C with the sintering additives of Y2O3 and MgO. It is found that with more fine β-Si3N4 powder in the starting powder, β-Si3N4 grains exhibit high thermal conductivity, which is partly resulted from the compaction of β-Si3N4 grains.

Tensile Creep Behavior of HPC at Early Ages under Different Curing Temperatures

2011 ◽  
Vol 250-253 ◽  
pp. 434-439 ◽  
Author(s):  
Yang Yang ◽  
Peng Li ◽  
Yan Ping Wu
Keyword(s):  
Creep Rate ◽  
Creep Behavior ◽  
Strength Class ◽  
Concrete Specimen ◽  
Curing Temperature ◽  
Tensile Creep ◽  
Uniaxial Tensile ◽  
Creep Coefficient ◽  
The Difference ◽  
Uniaxial Tensile Creep

This paper presents an experimental investigation on tensile basic creep behavior of HPC at early ages by using a uniaxial tensile creep testing apparatus. Concrete specimens of 100×100×400mm with compressive strength class 60MPa was used, sealed and loaded at different curing temperature. The effects of the curing temperature and the age at loading on creep behavior are discussed. The results show that tensile specific creep and creep rate of HPC at early ages were governed by the age at loading. The specific creep, creep coefficient and creep rate were larger at earlier loading ages, and decreased exponentially with age at loading. The tensile specific creep decreased with curing temperature, but the difference in creep due to different curing temperatures decreased with the age at loading, and could be ignored while concrete specimen being loaded after the age of 7 days.

Effects of Yb_2O_3 and Al_2O_3 additions on hardness of silicon nitride ceramics at the high temperature

2003 ◽  
Vol 2003.9 (0) ◽  
pp. 189-190
Author(s):  
Hidenori SAITO ◽  
Toshiyuki UENO ◽  
Saburo SANO ◽  
Yukio MAKINO ◽  
Shoji MIYAKE
Keyword(s):  
High Temperature ◽  
Silicon Nitride ◽  
Nitride Ceramics
Sign in / Sign up

Export Citation Format

Share Document