The Taï Plaque and Calendrical Notation in the Upper Palaeolithic

1991 ◽  
Vol 1 (1) ◽  
pp. 25-61 ◽  
Author(s):  
Alexander Marshack

Analysis of the Taï plaque, the most complex Upper Palaeolithic composition, has revealed evidence of the problem-solving and visual cueing strategies involved in the accumulation of the marks. The composition consists of a boustrophedon sequence of short horizontal containing lines or sections, each of which carries irregular subsets of marks. The analysis proceeded in stages over a period of twenty years, initially with use of a microscope, but did not involve cross-sectional analysis or counting. The theoretical assumption guiding the analysis was that notations represent a cognitive form of visual problem-solving and structuring. A test of the sequence of containing lines and their subsets of marks suggested the notation on the Taï plaque was a non-arithmetic form of lunar/solar observational recording. The analysis, if validated, carries profound implications for our understanding of Upper Palaeolithic culture, and cultural features of the indigenous European population in the periods that followed.

2012 ◽  
Vol 58 (4) ◽  
pp. 472-476 ◽  
Author(s):  
Caroline Filla Rosaneli ◽  
Flavia Auler ◽  
Carla Barreto Manfrinato ◽  
Claudine Filla Rosaneli ◽  
Caroline Sganzerla ◽  
...  

2017 ◽  
Vol 48 (S 01) ◽  
pp. S1-S45
Author(s):  
M. Zielonka ◽  
S. Garbade ◽  
S. Kölker ◽  
G. Hoffmann ◽  
M. Ries

2019 ◽  
Author(s):  
Patricia Clark ◽  
Annarella Barbato ◽  
Miguel Angel Guagnelli ◽  
Jose Alberto Rascon ◽  
Edgar Denova ◽  
...  

Diabetes ◽  
2020 ◽  
Vol 69 (Supplement 1) ◽  
pp. 2174-PUB
Author(s):  
NARAYANAN NK ◽  
CS DWARAKANATH ◽  
VENKATARAMAN S ◽  
MANIKANDAN RM ◽  
NARENDRA BS ◽  
...  

Author(s):  
B. Domengès ◽  
P. Poirier

Abstract In this study, the resistance of FIB prepared vias was characterized by the Kelvin probe technique and their physical characteristics studied using cross-sectional analysis. Two domains of resistivity were isolated in relation to the ion beam current used for the deposition of the via metal (Pt). Also submicrometer vias were investigated on 4.2 µm deep metal lines of a BiCMOS aluminum based design and a CMOS 090 copper based one. It is shown that the controlling parameter is the shape and volume of the contact, and that the contact formation is favored by the amount of over-mill of the via into the metal line it will contact.


2019 ◽  
Author(s):  
Yanink Caro-Vega ◽  
Pablo F. Belaunzarán-Zamudio ◽  
Jesús Alegre-Díaz ◽  
Brenda Crabtree-Ramírez ◽  
Raúl Ramírez-Reyes ◽  
...  

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