scholarly journals A Monochromatic, Aberration-Corrected, Dual-Beam Low Energy Electron Microscope for DNA Sequencing and Surface Analysis

2013 ◽  
Vol 19 (S2) ◽  
pp. 314-315
Author(s):  
M. Mankos ◽  
K. Shadman ◽  
H. Persson ◽  
A. N'Diaye ◽  
A. Schmid ◽  
...  

Extended abstract of a paper presented at Microscopy and Microanalysis 2013 in Indianapolis, Indiana, USA, August 4 – August 8, 2013.

2014 ◽  
Vol 145 ◽  
pp. 36-49 ◽  
Author(s):  
M. Mankos ◽  
K. Shadman ◽  
H.H.J. Persson ◽  
A.T. N’Diaye ◽  
A.K. Schmid ◽  
...  

2020 ◽  
Vol 216 ◽  
pp. 113017
Author(s):  
Lei Yu ◽  
Weishi Wan ◽  
Takanori Koshikawa ◽  
Meng Li ◽  
Xiaodong Yang ◽  
...  

2013 ◽  
Vol 26 (4) ◽  
pp. 369-373 ◽  
Author(s):  
Guan‐hua Zhang ◽  
Ju‐long Sun ◽  
Yan‐ling Jin ◽  
Kan Zang ◽  
Fang‐zhun Guo ◽  
...  

2008 ◽  
Vol 1088 ◽  
Author(s):  
Marian Mankos ◽  
Vassil Spasov ◽  
Liqun Han ◽  
Shinichi Kojima ◽  
Ximan Jiang ◽  
...  

AbstractA novel low energy electron microscope (LEEM) aimed at improving the throughput and extending the applications for semiconductor devices has been developed. A dual beam approach, where two beams with different landing energies illuminate the field of view, is used to mitigate the charging effects when the LEEM is used to image semiconductor substrates with insulating or composite (insulator, semiconductor, metal) surfaces. We have experimentally demonstrated this phenomenon by imaging a variety of semiconductor device wafers without deleterious charging effects. Results from several important semiconductor device layers will be illustrated in detail.


Author(s):  
Bertholdand Senftinger ◽  
Helmut Liebl

During the last few years the investigation of clean and adsorbate-covered solid surfaces as well as thin-film growth and molecular dynamics have given rise to a constant demand for high-resolution imaging microscopy with reflected and diffracted low energy electrons as well as photo-electrons. A recent successful implementation of a UHV low-energy electron microscope by Bauer and Telieps encouraged us to construct such a low energy electron microscope (LEEM) for high-resolution imaging incorporating several novel design features, which is described more detailed elsewhere.The constraint of high field strength at the surface required to keep the aberrations caused by the accelerating field small and high UV photon intensity to get an improved signal-to-noise ratio for photoemission led to the design of a tetrode emission lens system capable of also focusing the UV light at the surface through an integrated Schwarzschild-type objective. Fig. 1 shows an axial section of the emission lens in the LEEM with sample (28) and part of the sample holder (29). The integrated mirror objective (50a, 50b) is used for visual in situ microscopic observation of the sample as well as for UV illumination. The electron optical components and the sample with accelerating field followed by an einzel lens form a tetrode system. In order to keep the field strength high, the sample is separated from the first element of the einzel lens by only 1.6 mm. With a numerical aperture of 0.5 for the Schwarzschild objective the orifice in the first element of the einzel lens has to be about 3.0 mm in diameter. Considering the much smaller distance to the sample one can expect intense distortions of the accelerating field in front of the sample. Because the achievable lateral resolution depends mainly on the quality of the first imaging step, careful investigation of the aberrations caused by the emission lens system had to be done in order to avoid sacrificing high lateral resolution for larger numerical aperture.


2010 ◽  
Vol 110 (11) ◽  
pp. 1358-1361 ◽  
Author(s):  
Th. Schmidt ◽  
H. Marchetto ◽  
P.L. Lévesque ◽  
U. Groh ◽  
F. Maier ◽  
...  

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