H-Type-like Aggregation-Accelerated Singlet Fission Process in Dipyrrolonaphthyridinedione Thin Film: The Role of Charge Transfer/Excimer Mixed Intermediate State

2021 ◽  
pp. 12276-12282
Author(s):  
Long Wang ◽  
Wanlin Cai ◽  
Jing Sun ◽  
Yuling Wu ◽  
Bin Zhang ◽  
...  
Keyword(s):  
Thin Film ◽  
Charge Transfer ◽  
Intermediate State ◽  
Singlet Fission ◽  
Fission Process

scholarly journals Towards multistate multimode landscapes in singlet fission of pentacene: the dual role of charge-transfer states

2021 ◽  
Vol 12 (39) ◽  
pp. 12928-12938
Author(s):  
Rajat Walia ◽  
Zexiang Deng ◽  
Jun Yang
Keyword(s):  
Charge Transfer ◽  
Dual Role ◽  
Singlet Fission

Singlet fission in pentacene necessitates the vibronic progression of weak and strong charge-transfer states with correlated triplet pairs.

Theoretical Investigation of Singlet Fission in Molecular Dimers: The Role of Charge Transfer States and Quantum Interference

2014 ◽  
Vol 118 (26) ◽  
pp. 14192-14199 ◽  
Author(s):  
Fatemeh Mirjani ◽  
Nicolas Renaud ◽  
Natalie Gorczak ◽  
Ferdinand C. Grozema
Keyword(s):  
Charge Transfer ◽  
Theoretical Investigation ◽  
Quantum Interference ◽  
Singlet Fission

Absence of Intramolecular Singlet Fission in Pentacene–Perylenediimide Heterodimers: The Role of Charge Transfer State

2017 ◽  
Vol 8 (22) ◽  
pp. 5609-5615 ◽  
Author(s):  
Long Wang ◽  
Yishi Wu ◽  
Jianwei Chen ◽  
Lanfen Wang ◽  
Yanping Liu ◽  
...  
Keyword(s):  
Charge Transfer ◽  
Charge Transfer State ◽  
Singlet Fission ◽  
Transfer State

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Dynamic adjustment of emission from both singlets and triplets: the role of excited state conformation relaxation and charge transfer in phenothiazine derivates

2021 ◽  
Author(s):  
Weidong Qiu ◽  
Xinyi Cai ◽  
Mengke Li ◽  
Liangying Wang ◽  
Yanmei He ◽  
...  
Keyword(s):  
Excited State ◽  
Charge Transfer ◽  
Intramolecular Charge Transfer ◽  
Dynamic Adjustment ◽  
Twisted Intramolecular Charge Transfer

Dynamic adjustment of emission behaviours by controlling the extent of twisted intramolecular charge transfer character in excited state.

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