Preparation of Low-Boron Silicon from Diamond Wire Sawing Waste by Pressure-Less Sintering and CaO–SiO2 Slag Treatment

2020 ◽  
Vol 8 (31) ◽  
pp. 11755-11763 ◽  
Author(s):  
Yaohao Zhang ◽  
Wang Sheng ◽  
Liuqing Huang ◽  
Sa Zhang ◽  
Guangyu Chen ◽  
...  
Keyword(s):  
Diamond Wire ◽  
Slag Treatment ◽  
Diamond Wire Sawing

scholarly journals Simulation of the ductile machining mode of silicon

2021 ◽  
Author(s):  
Hagen Klippel ◽  
Stefan Süssmaier ◽  
Matthias Röthlin ◽  
Mohamadreza Afrasiabi ◽  
Uygar Pala ◽  
...  
Keyword(s):  
Brittle Material ◽  
Material Removal ◽  
Machining Process ◽  
Ductile Material ◽  
Diamond Wire ◽  
Ductile Machining ◽  
Mesh Free ◽  
Diamond Wire Sawing ◽  
Material Removal Mode ◽  
Brittle Material Removal

AbstractDiamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Under certain conditions, the generally brittle material can be machined in ductile mode, whereby considerably fewer cracks occur in the surface than with brittle material removal. In the presented paper, a numerical model is developed in order to support the optimisation of the machining process regarding the transition between ductile and brittle material removal. The simulations are performed with an GPU-accelerated in-house developed code using mesh-free methods which easily handle large deformations while classic methods like FEM would require intensive remeshing. The Johnson-Cook flow stress model is implemented and used to evaluate the applicability of a model for ductile material behaviour in the transition zone between ductile and brittle removal mode. The simulation results are compared with results obtained from single grain scratch experiments using a real, non-idealised grain geometry as present in the diamond wire sawing process.

Investigation on the sawing temperature in ultrasonic vibration assisted diamond wire sawing monocrystalline silicon

2021 ◽  
Vol 135 ◽  
pp. 106070
Author(s):  
Yan Wang ◽  
Li-Xing Song ◽  
Jian-Guo Liu ◽  
Rui Wang ◽  
Bo-Cheng Zhao
Keyword(s):  
Ultrasonic Vibration ◽  
Monocrystalline Silicon ◽  
Diamond Wire ◽  
Diamond Wire Sawing

Research on the capillary penetration mechanism of cutting fluid supplied by electrostatic spraying in diamond wire sawing

2021 ◽  
Vol 71 ◽  
pp. 212-223
Author(s):  
Chunyan Yao ◽  
Kaixiang Xu ◽  
Dongdong Chen ◽  
Hongbing Wang ◽  
Yunfeng Liu
Keyword(s):  
Cutting Fluid ◽  
Diamond Wire ◽  
Electrostatic Spraying ◽  
Penetration Mechanism ◽  
Diamond Wire Sawing

Photocatalytic H2 evolution by AgNP@PSi/SiNS composite derived from diamond-wire sawing silicon waste

2021 ◽  
pp. 111495
Author(s):  
Xiufeng Li ◽  
Guoqiang Lv ◽  
Wenhui Ma ◽  
Shaoyuan Li ◽  
Jia Yang ◽  
...  
Keyword(s):  
H2 Evolution ◽  
Diamond Wire ◽  
Diamond Wire Sawing ◽  
Photocatalytic H2 Evolution

Recovery of silicon kerf waste from diamond wire sawing by two-step sintering and acid leaching method

2020 ◽  
Vol 265 ◽  
pp. 121911 ◽  
Author(s):  
Yaohao Zhang ◽  
Wang Sheng ◽  
Liuqing Huang ◽  
Chentong Zhang ◽  
Xueyuan Tang ◽  
...  
Keyword(s):  
Acid Leaching ◽  
Diamond Wire ◽  
Diamond Wire Sawing

The impact of silicon brick polishing on thin (120 μm) silicon wafer sawing yields and fracture strengths in diamond-wire sawing

2020 ◽  
Vol 105 ◽  
pp. 104751 ◽  
Author(s):  
Halubai Sekhar ◽  
Tetsuo Fukuda ◽  
Katsuto Tanahashi ◽  
Hidetaka Takato
Keyword(s):  
Silicon Wafer ◽  
Diamond Wire ◽  
Diamond Wire Sawing ◽  
The Impact

Study on the Wear of Diamond Beads in Wire Sawing

2006 ◽  
Vol 532-533 ◽  
pp. 436-439 ◽  
Author(s):  
Hui Huang ◽  
Xi Peng Xu
Keyword(s):  
Digital Video ◽  
Civil Engineering ◽  
Machining Process ◽  
Matrix System ◽  
Diamond Wire ◽  
Video Microscope ◽  
Moving Direction ◽  
Diamond Wire Sawing ◽  
Sawing Process

Diamond wire sawing has been used for many applications in stone industries and civil engineering several decades ago. The wear of bead is a major factor that affects wire-sawing performance in machining process. In this paper, seven diamond wires with different matrix system and different structures are taken from the factory. The diameters in the front, middle and end of bead along the moving direction of diamond wire, are measured respectively. The wear of diamond grits is also observed using a digital video microscope system. It is show that the wear of bead varies along the moving direction of diamond wire. The wear in the front of bead is greater than the others. The diameter gaps are associated with the type of matrix and the wear of diamond grits. The diameter gaps keep constant in the smooth sawing process.

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