Study on the Wear of Diamond Beads in Wire Sawing

Diamond wire sawing has been used for many applications in stone industries and civil engineering several decades ago. The wear of bead is a major factor that affects wire-sawing performance in machining process. In this paper, seven diamond wires with different matrix system and different structures are taken from the factory. The diameters in the front, middle and end of bead along the moving direction of diamond wire, are measured respectively. The wear of diamond grits is also observed using a digital video microscope system. It is show that the wear of bead varies along the moving direction of diamond wire. The wear in the front of bead is greater than the others. The diameter gaps are associated with the type of matrix and the wear of diamond grits. The diameter gaps keep constant in the smooth sawing process.

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Simulation of the ductile machining mode of silicon

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-021-07167-3 ◽

2021 ◽

Author(s):

Hagen Klippel ◽

Stefan Süssmaier ◽

Matthias Röthlin ◽

Mohamadreza Afrasiabi ◽

Uygar Pala ◽

...

Keyword(s):

Brittle Material ◽

Material Removal ◽

Machining Process ◽

Ductile Material ◽

Diamond Wire ◽

Ductile Machining ◽

Mesh Free ◽

Diamond Wire Sawing ◽

Material Removal Mode ◽

Brittle Material Removal

AbstractDiamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Under certain conditions, the generally brittle material can be machined in ductile mode, whereby considerably fewer cracks occur in the surface than with brittle material removal. In the presented paper, a numerical model is developed in order to support the optimisation of the machining process regarding the transition between ductile and brittle material removal. The simulations are performed with an GPU-accelerated in-house developed code using mesh-free methods which easily handle large deformations while classic methods like FEM would require intensive remeshing. The Johnson-Cook flow stress model is implemented and used to evaluate the applicability of a model for ductile material behaviour in the transition zone between ductile and brittle removal mode. The simulation results are compared with results obtained from single grain scratch experiments using a real, non-idealised grain geometry as present in the diamond wire sawing process.

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Preparation of Al–Si alloys with silicon cutting waste from diamond wire sawing process

Journal of Environmental Management ◽

10.1016/j.jenvman.2021.112548 ◽

2021 ◽

Vol 290 ◽

pp. 112548

Author(s):

Donghui Wei ◽

Jian Kong ◽

Shuaibo Gao ◽

Shibo Zhou ◽

Yanxin Zhuang ◽

...

Keyword(s):

Diamond Wire ◽

Diamond Wire Sawing ◽

Sawing Process

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Investigation on the Stiffness of Wire Web of Multi Wire Sawing Machine and Its Influence on Machining Accuracy

10.21203/rs.3.rs-380401/v1 ◽

2021 ◽

Author(s):

jian qiu ◽

Shanbao Zhang ◽

Rilai Fu ◽

He Zhu ◽

Guodong Yang ◽

...

Keyword(s):

Machine Tools ◽

Metal Cutting ◽

Semiconductor Industry ◽

Machining Process ◽

Machining Accuracy ◽

Special Significance ◽

Evaluation Standard ◽

Diamond Wire ◽

Cutting Machine ◽

Diamond Wire Sawing

Abstract Diamond wire sawing has gradually applied as the dominant way of silicon sawing in the photovoltaic and semiconductor industry. In the design and evaluation field of diamond wire sawing machine, little research on the static stiffness are presented. But in the design field of traditional metal cutting machine tools, stiffness is an extremely important performance index. The stiffness of wire web should be mastered to improve the machining accuracy of diamond wire sawing. The special significance of this study is that stiffness of wire web is considered to be the key index of multi wire sawing performance, as a result, wire lag and wire bow due to the loss of the stiffness of wire web could be minimized. Aiming at the problem of the stiffness of wire web, the measurement method, process and evaluation standard were proposed. The influence of the stiffness of wire web on the machining process, wire bow, cutting force, machining accuracy and other factors were studied.

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Characterization of the Diamond Wire Sawing Process for Monocrystalline Silicon by Raman Spectroscopy and SIREX Polarimetry

Energies ◽

10.3390/en10040414 ◽

2017 ◽

Vol 10 (4) ◽

pp. 414 ◽

Cited By ~ 7

Author(s):

Sindy Würzner ◽

Martin Herms ◽

Thomas Kaden ◽

Hans Möller ◽

Matthias Wagner

Keyword(s):

Raman Spectroscopy ◽

Monocrystalline Silicon ◽

Diamond Wire ◽

Diamond Wire Sawing ◽

Sawing Process

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The mechanics of sawing granite with diamond wire

10.21203/rs.3.rs-377624/v1 ◽

2021 ◽

Author(s):

Janusz Stefan Konstanty

Keyword(s):

Machine Design ◽

Diamond Wire ◽

Wire Saw ◽

Diamond Wire Saw ◽

High Incidence ◽

Wire Vibration ◽

Circular Sawing ◽

Diamond Wire Sawing ◽

Sawing Process ◽

System Characteristics

Abstract A theoretical model of sawing granite by means of a diamond wire saw, composed of a multitude of diamond-impregnated beads mounted onto a steel rope, is presented. The wire sawing process has been contrasted with circular sawing with respect to diamond loading conditions. The analytical treatments have been supported by industrial quantitative assessments and qualitative observations. The evaluation of cutting forces as well as identification of system characteristics affecting wire vibration and wire rotation are instrumental in both machine design and tool formulation. This knowledge is also useful to diagnose and prevent problems inherent in diamond wire sawing of granite, such as the high incidence of wire breakage, unsatisfactory tool life and cutting capability, eccentric bead wear, etc.

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