scholarly journals Experimental characterization of a quantum many-body system via higher-order correlations

Nature ◽  
2017 ◽  
Vol 545 (7654) ◽  
pp. 323-326 ◽  
Author(s):  
Thomas Schweigler ◽  
Valentin Kasper ◽  
Sebastian Erne ◽  
Igor Mazets ◽  
Bernhard Rauer ◽  
...  
Keyword(s):  
Higher Order ◽  
Experimental Characterization ◽  
Body System ◽  
Many Body

scholarly journals Characterization of an operational quantum resource in a critical many-body system

2020 ◽  
Vol 22 (8) ◽  
pp. 083077
Author(s):  
S Sarkar ◽  
C Mukhopadhyay ◽  
A Bayat
Keyword(s):  
Body System ◽  
Many Body

scholarly journals Experimental characterization of the quantum many-body localization transition

2021 ◽  
Vol 3 (3) ◽  
Author(s):  
Ming Gong ◽  
Gentil D. de Moraes Neto ◽  
Chen Zha ◽  
Yulin Wu ◽  
Hao Rong ◽  
...  
Keyword(s):  
Experimental Characterization ◽  
Many Body ◽  
Localization Transition

scholarly journals Higher Order Gravitational Potential for Many-Body System

1974 ◽  
Vol 51 (4) ◽  
pp. 1220-1238 ◽  
Author(s):  
T. Ohta ◽  
H. Okamura ◽  
T. Kimura ◽  
K. Hiida
Keyword(s):  
Gravitational Potential ◽  
Higher Order ◽  
Body System ◽  
Many Body

scholarly journals Experimental Characterization of Quantum Dynamics Through Many-Body Interactions

2013 ◽  
Vol 110 (6) ◽  
Author(s):  
Daniel Nigg ◽  
Julio T. Barreiro ◽  
Philipp Schindler ◽  
Masoud Mohseni ◽  
Thomas Monz ◽  
...  
Keyword(s):  
Quantum Dynamics ◽  
Experimental Characterization ◽  
Many Body ◽  
Many Body Interactions

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Experimental Characterization of Mechanical Behavior of Cord-Rubber Composites

1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert
Keyword(s):  
Response Characteristic ◽  
Cord Compression ◽  
Complete Characterization ◽  
Strain Response ◽  
Strain Gages ◽  
Experimental Characterization ◽  
Rubber Composites ◽  
Stress Strain ◽  
Strain Data

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.

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