Microfluidic on-demand droplet merging using surface acoustic waves

Lab on a Chip ◽  
2014 ◽  
Vol 14 (17) ◽  
pp. 3325-3333 ◽  
Author(s):  
Muhsincan Sesen ◽  
Tuncay Alan ◽  
Adrian Neild

Digital microfluidic chip merges multiple consecutive droplets (nl) selectively and controllably using surface acoustic waves.

Lab on a Chip ◽  
2020 ◽  
Vol 20 (21) ◽  
pp. 3914-3921
Author(s):  
Kirk Mutafopulos ◽  
Peter J. Lu ◽  
Ryan Garry ◽  
Pascal Spink ◽  
David A. Weitz

We generate traveling surface acoustic waves with an interdigital transducer to create droplets on-demand; encapsulate single cells; lyse cells and immediately encapsulate their contents; and pico-inject new materials into existing droplets.


Lab on a Chip ◽  
2016 ◽  
Vol 16 (17) ◽  
pp. 3235-3243 ◽  
Author(s):  
Jin Ho Jung ◽  
Ghulam Destgeer ◽  
Byunghang Ha ◽  
Jinsoo Park ◽  
Hyung Jin Sung

We demonstrated the operation of an acoustomicrofluidic device composed of a polydimethylsiloxane (PDMS) microchannel and a slanted-finger interdigitated transducer (SF-IDT), for the on-demand splitting of droplets in an active, accurate, rapid, and size-controllable manner.


2015 ◽  
Vol 25 (37) ◽  
pp. 5895-5901 ◽  
Author(s):  
Richie J. Shilton ◽  
Virgilio Mattoli ◽  
Marco Travagliati ◽  
Matteo Agostini ◽  
Andrea Desii ◽  
...  

Lab on a Chip ◽  
2015 ◽  
Vol 15 (14) ◽  
pp. 3030-3038 ◽  
Author(s):  
Muhsincan Sesen ◽  
Tuncay Alan ◽  
Adrian Neild

A microfluidic chip capable of steering and unevenly splitting plugs at a Y-junction uses surface acoustic waves.


2017 ◽  
Vol 89 (4) ◽  
pp. 2211-2215 ◽  
Author(s):  
Jin Ho Jung ◽  
Ghulam Destgeer ◽  
Jinsoo Park ◽  
Husnain Ahmed ◽  
Kwangseok Park ◽  
...  

Lab on a Chip ◽  
2013 ◽  
Vol 13 (16) ◽  
pp. 3225 ◽  
Author(s):  
David J. Collins ◽  
Tuncay Alan ◽  
Kristian Helmerson ◽  
Adrian Neild

Author(s):  
Kemining W. Yeh ◽  
Richard S. Muller ◽  
Wei-Kuo Wu ◽  
Jack Washburn

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.


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