Preparation of an ion imprinted chitosan-based porous film with an interpenetrating network structure for efficient selective adsorption of Gd(iii)

2021 ◽  
Author(s):  
Enli Liu ◽  
Xue Lin ◽  
Dan Zhang ◽  
Wenbiao Xu ◽  
Junyou Shi ◽  
...  

In this work, a new Gd(III) ion imprinted CS-based porous film with interpenetrating network structure was fabricated by a simple polymerization–evaporation approach for the efficient selective adsorption of Gd(III) from aqueous solution.

2013 ◽  
Vol 643 ◽  
pp. 83-86 ◽  
Author(s):  
Jing Jing Wang ◽  
Fang Liu

A novel thermoresponsive Cu(II) ion-imprinted hydrogel [Cu(II)-IIH] with interpenetrating network structure has been prepared to remove Cu(II) ions with high selectivity. The Cu(II)-IIH was prepared by free radical/cationic hybrid photopolymerization of N-isopropylacrylamide (NIPAM) and triethylene glycol divinyl ether (DVE-3) using Cu(II) ion as template. The Cu(II)-IIH was used to remove heavy metal ions from aqueous solution at 20 and 40oC. The Cu(II)-IIH selectively bound the template ion above a lower critical solution temperature (LCST) of poly(N-isopropylacrylamide) (PNIPAM). The memory was fixed by shrinking above the LCST, and was deleted by swelling below the LCST. Selective adsorption study indicated that ion imprinting resulted in stronger affinity of the Cu(II)-IIH toward Cu(II) ions than other competitor metal ions compared with the non-imprinted hydrogel (NIH).


2018 ◽  
Vol 20 (18) ◽  
pp. 12870-12878 ◽  
Author(s):  
Delong Kong ◽  
Ning Qiao ◽  
Nian Wang ◽  
Zhuo Wang ◽  
Qi Wang ◽  
...  

A novel nanostructured magnetic ion-imprinted polymer was synthesized for the selective adsorption of lead(ii) from aqueous solution.


RSC Advances ◽  
2015 ◽  
Vol 5 (118) ◽  
pp. 97435-97445 ◽  
Author(s):  
Yuling Cai ◽  
Liuchun Zheng ◽  
Zhanqiang Fang

To reduce costs and improve practicability, IMCS was synthesized through co-precipitation using steel pickling waste liquor and chitosan and Cu(ii) as template ions, which was then characterized by TEM, SEM, EDX, FTIR, XRD and VSM.


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