Silicon-based fabrication process for production of optical waveguides

1996 ◽  
Vol 143 (1) ◽  
pp. 37-40 ◽  
Author(s):  
I.R. Johnston ◽  
G.J. Parker
2011 ◽  
Vol 403-408 ◽  
pp. 4295-4299
Author(s):  
H. Hazura ◽  
A.R. Hanim ◽  
B. Mardiana ◽  
Sahbudin Shaari ◽  
P.S. Menon

We present a detailed fabrication process of silicon optical waveguide with a depth of 4μm via simulation and experiment. An anisotropic wet etching using Potassium Hydroxide (KOH) solutions was selected to study the influence of major fabrication parameters such as etch rate, oxidation time and development time to the fabrication performance. The fabrication of the silicon waveguide with the orientation of was modeled using ATHENA from 2D Silvaco software and was later compared with the actual fabricated device. Etching time of 4 minutes was required to etch the Si to the depth of 4μm to obtain a perfectly trapeizoidal optical waveguide structure. Our results show that the simulation model is trustworthy to predict the performance of the practical anisotropic wet etching fabrication process. The silicon-based waveguide components are targeted to be employed in realizing future photonic devices such as optical modulators.


1988 ◽  
Vol 126 ◽  
Author(s):  
B. L. Weiss ◽  
G. T. Reed

ABSTRACTIn this paper the fabrication process and characteristics of waveguides produced by He+ implantation in Y-cut X- and Z-propagating LiNbO3 are presented It is shown that low propagation losses, down to 1dB cm−1 at λ = 633μm can be obtained for TM modes only in Y-cut X-propagation samples whilst Y-cut Z propagating samples support both TE and TM modes with relatively low losses.


2015 ◽  
Vol 2015 ◽  
pp. 1-10 ◽  
Author(s):  
Tero Jalkanen ◽  
Anni Määttänen ◽  
Ermei Mäkilä ◽  
Jaani Tuura ◽  
Martti Kaasalainen ◽  
...  

A roll-to-roll compatible fabrication process of porous silicon (pSi) based sensing elements for a real-time humidity monitoring is described. The sensing elements, consisting of printed interdigitated silver electrodes and a spray-coated pSi layer, were fabricated on a coated paper substrate by a two-step process. Capacitive and resistive responses of the sensing elements were examined under different concentrations of humidity. More than a three orders of magnitude reproducible decrease in resistance was measured when the relative humidity (RH) was increased from 0% to 90%. A relatively fast recovery without the need of any refreshing methods was observed with a change in RH. Humidity background signal and hysteresis arising from the paper substrate were dependent on the thickness of sensing pSi layer. Hysteresis in most optimal sensing element setup (a thick pSi layer) was still noticeable but not detrimental for the sensing. In addition to electrical characterization of sensing elements, thermal degradation and moisture adsorption properties of the paper substrate were examined in connection to the fabrication process of the silver electrodes and the moisture sensitivity of the paper. The results pave the way towards the development of low-cost humidity sensors which could be utilized, for example, in smart packaging applications or in smart cities to monitor the environment.


2005 ◽  
Vol 480-481 ◽  
pp. 429-436
Author(s):  
M. Domenech ◽  
G. Lifante ◽  
F. Cussó ◽  
A. Parisi ◽  
A.C. Cino ◽  
...  

In this work, the complete fabrication process which combines Proton Exchange (PE) and Reverse Proton Exchange (RPE) in Neodymium doped LiNbO3 channel waveguides is reported. To produce the PE-RPE channel waveguides the fabrication of dielectric SiO2 masks had to be implemented. For this propose, we adopted a technique based on the Ion Plating Plasma Assisted Deposition of SiO2 followed by the standard ultraviolet photolithographic patterning. On the other hand, we determined the main optical and spectroscopic properties of Nd3+ ions in the channel waveguides including the study of the lifetime as function as the polarisation.


2009 ◽  
Vol 29 (7) ◽  
pp. 1983-1986
Author(s):  
吴远大 Wu Yuanda ◽  
安俊明 An Junming ◽  
李建光 Li Jianguang ◽  
王玥 Wang Yue ◽  
尹小杰 Yin Xiaojie ◽  
...  

2014 ◽  
Vol 609-610 ◽  
pp. 758-768 ◽  
Author(s):  
Yi Wei Zhuang ◽  
Zheng Xi Cheng ◽  
Xue Min Zhang ◽  
Hong Hui Yuan

The neural probe array is an important tool for getting the neural signals. Giving consideration to the biological compatibility and the demand of integrating in circuit, new fabrication process of a silicon-based three-dimension neural probe array was reported. The idea about milling in mechanical process and the method of structure for transfer were introduced in the fabrication. The 10*10 scale silicon-based three-dimension probe arrays integrated in the readout circuit directly were fabricated by means of flip chip and multi-blade mixing dicing techniques. In the entire fabrication process, no any high-temperature process and silicon wet etching process, which would damage the circuit, were included. Using the fabrication process above, the 10*10 scale silicon-based probe arrays with centre-to-centre separation of 400 μm were achieved. In the probe arrays, whose good rate was more than 95%, the width of a single probe was 100 μm, the tip angle was 25o, and the height was more than 1.4 mm. Through the fabrication process, it was not only reducing the pin count greatly, but also simplifying the interface effectively. By the in vivo experiment of the Sprague Dawley rat, the corresponding nerve signal was obtained.


2006 ◽  
Author(s):  
V. Korampally ◽  
S. Bhattacharya ◽  
Yuanfang Gao ◽  
S.A. Grant ◽  
S.B. Kleiboeker ◽  
...  

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