scholarly journals Impact of the disconnection of cable shields on the thermal stress reduction in case of cross-country faults

2017 ◽  
Vol 2017 (1) ◽  
pp. 1188-1192
Author(s):  
Maurizio Della Corte ◽  
Luigi D'orazio ◽  
Andrea Malerba ◽  
Federico Marmeggi
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Cross Country

scholarly journals IGBT Thermal Stress Reduction Using Advance Control Strategy

Procedia CIRP ◽  
2017 ◽  
Vol 59 ◽  
pp. 274-279 ◽  
Author(s):  
Payam Soulatiantork ◽  
Alireza Alghassi ◽  
Marco Faifer ◽  
Suresh Perinpanayagam
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Control Strategy

Thermal-stress reduction for a Czochralski grown single crystal

2006 ◽  
Vol 59 (1) ◽  
pp. 1-23 ◽  
Author(s):  
Huaxiong Huang ◽  
Shuqing Liang
Keyword(s):  
Thermal Stress ◽  
Single Crystal ◽  
Stress Reduction ◽  
Grown Single Crystal

ACTIVE COOLING AND THERMAL STRESS REDUCTION IN A POROELASTIC HOLLOW SPHERE

1997 ◽  
Vol 20 (3-4) ◽  
pp. 389-405 ◽  
Author(s):  
Tsuyoshi Kodashima ◽  
Michio Kurasbige
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Hollow Sphere ◽  
Active Cooling

Thermal stress reduction strategy for high-temperature power electronics with Ag sintering

2021 ◽  
Vol 127 ◽  
pp. 114379
Author(s):  
Hui Ren ◽  
Guisheng Zou ◽  
Qiang Jia ◽  
Zhongyang Deng ◽  
Chengjie Du ◽  
...  
Keyword(s):  
Thermal Stress ◽  
High Temperature ◽  
Power Electronics ◽  
Stress Reduction ◽  
Reduction Strategy

Thermal Stress Reduction of Copper Through Silicon Via (TSV) with Annealing

2018 ◽  
Vol 7 (11) ◽  
pp. P689-P692 ◽  
Author(s):  
Van Quy Dinh ◽  
Kazuo Kondo ◽  
Van Ha Hoang ◽  
Tetsuji Hirato
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Through Silicon Via

scholarly journals Thermal Stress Reduction and Strength Evaluation ofWelded Joints for Dissimilar Materials

2015 ◽  
Vol 51 (9) ◽  
pp. 409-415
Author(s):  
Kazumasa SHIMAMOTO ◽  
Yu SEKIGUCHI ◽  
Chiaki SATO
Keyword(s):  
Thermal Stress ◽  
Stress Reduction ◽  
Dissimilar Materials ◽  
Strength Evaluation

Effectiveness of compositionally linearly graded interlayers for thermal stress reduction

2009 ◽  
Vol 517 (8) ◽  
pp. 2691-2696 ◽  
Author(s):  
Yizeng Li ◽  
Yongzhong Huo
Keyword(s):  
Thermal Stress ◽  
Stress Reduction
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