EFFECTS OF A BOUNDARY NODE ON GRAIN-BOUNDARY SLIDING AND INTERGRANULAR FRACTURE IN Cu-9at.%Al TRICRYSTALS

1990 ◽  
Vol 51 (C1) ◽  
pp. C1-587-C1-592
Author(s):  
S. MIURA ◽  
T. OKADA ◽  
S. ONAKA ◽  
S. HASHIMOTO
1989 ◽  
Vol 23 (1) ◽  
pp. 49-54 ◽  
Author(s):  
Tatsuya Okada ◽  
Susuma Onaka ◽  
Satoshi Hashimoto ◽  
Sei Miura

Author(s):  
Nancy J. Tighe

Silicon nitride is one of the ceramic materials being considered for the components in gas turbine engines which will be exposed to temperatures of 1000 to 1400°C. Test specimens from hot-pressed billets exhibit flexural strengths of approximately 50 MN/m2 at 1000°C. However, the strength degrades rapidly to less than 20 MN/m2 at 1400°C. The strength degradition is attributed to subcritical crack growth phenomena evidenced by a stress rate dependence of the flexural strength and the stress intensity factor. This phenomena is termed slow crack growth and is associated with the onset of plastic deformation at the crack tip. Lange attributed the subcritical crack growth tb a glassy silicate grain boundary phase which decreased in viscosity with increased temperature and permitted a form of grain boundary sliding to occur.


1983 ◽  
Vol 44 (C9) ◽  
pp. C9-759-C9-764
Author(s):  
E. Bonetti ◽  
A. Cavallini ◽  
E. Evangelista ◽  
P. Gondi

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