A study of grain boundary sliding in copper with and without an addition of phosphorus

2010 ◽  
Vol 405 (2) ◽  
pp. 131-137 ◽  
Author(s):  
Kjell Pettersson
Keyword(s):  
Grain Boundary ◽  
Grain Boundary Sliding ◽  
Boundary Sliding

Examination of Fracture Interfaces in Silicon Nitride

1975 ◽  
Vol 33 ◽  
pp. 60-61
Author(s):  
Nancy J. Tighe
Keyword(s):  
Silicon Nitride ◽  
Grain Boundary ◽  
Crack Growth ◽  
Subcritical Crack Growth ◽  
Slow Crack Growth ◽  
Ceramic Materials ◽  
Grain Boundary Sliding ◽  
Boundary Phase ◽  
Turbine Engines ◽  
Boundary Sliding

Silicon nitride is one of the ceramic materials being considered for the components in gas turbine engines which will be exposed to temperatures of 1000 to 1400°C. Test specimens from hot-pressed billets exhibit flexural strengths of approximately 50 MN/m2 at 1000°C. However, the strength degrades rapidly to less than 20 MN/m2 at 1400°C. The strength degradition is attributed to subcritical crack growth phenomena evidenced by a stress rate dependence of the flexural strength and the stress intensity factor. This phenomena is termed slow crack growth and is associated with the onset of plastic deformation at the crack tip. Lange attributed the subcritical crack growth tb a glassy silicate grain boundary phase which decreased in viscosity with increased temperature and permitted a form of grain boundary sliding to occur.

INTERNAL FRICTION PEAKS CONNECTED WITH GRAIN BOUNDARY SLIDING IN Al

1983 ◽  
Vol 44 (C9) ◽  
pp. C9-759-C9-764
Author(s):  
E. Bonetti ◽  
A. Cavallini ◽  
E. Evangelista ◽  
P. Gondi
Keyword(s):  
Internal Friction ◽  
Grain Boundary ◽  
Grain Boundary Sliding ◽  
Boundary Sliding

The Effect of Grain Boundary State on Deformation Process Development in Nanostructured Metals Produced by the Methods of Severe Plastic Deformation

2011 ◽  
Vol 683 ◽  
pp. 69-79 ◽  
Author(s):  
Evgeny V. Naydenkin ◽  
Galina P. Grabovetskaya ◽  
Konstantin Ivanov
Keyword(s):  
Plastic Deformation ◽  
Grain Boundary ◽  
Severe Plastic Deformation ◽  
Deformation Process ◽  
Process Development ◽  
Grain Boundary Sliding ◽  
Total Deformation ◽  
Nanostructured Metals ◽  
Boundary State ◽  
Boundary Sliding

In this review the investigations of deformation process development are discussed which were carried out by tension and creep in the temperature range Т<0.4Tm (here Тm is the absolute melting point of material) for nanostructured metals produced by the methods of severe plastic deformation. The contribution of grain boundary sliding to the total deformation in the above temperature interval is also considered. An analysis is made of the effect of grain size and grain boundary state on the evolution of grain boundary sliding and cooperative grain boundary sliding in nanostructured metals.

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