Thermal stability improvement by using Pd∕NiO∕Al∕Ti∕Au reflective ohmic contacts to p-GaN for flip-chip ultraviolet light-emitting diodes
2017 ◽
Vol 34
(7)
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pp. 074210
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2017 ◽
Vol 51
(3)
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pp. 035103
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2016 ◽
Vol 6
(10)
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pp. 1488-1492
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2017 ◽
Vol 64
(2)
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pp. 467-471
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