Determination of the R-line luminescence spatial resolution of a near-field optical spectroscopy system for piezospectroscopy

2007 ◽  
Vol 101 (12) ◽  
pp. 123527 ◽  
Author(s):  
T. Tomimatsu ◽  
Y. Kagawa ◽  
D. R. Clarke
Keyword(s):  
Optical Spectroscopy ◽  
Spatial Resolution ◽  
Near Field ◽  
Spectroscopy System

Accurate determination of the onset wavelength (λonset) in optical spectroscopy

2021 ◽  
Vol 265 ◽  
pp. 107544
Author(s):  
Austin M. Wallace ◽  
Christine Curiac ◽  
Jared H. Delcamp ◽  
Ryan C. Fortenberry
Keyword(s):  
Optical Spectroscopy ◽  
Accurate Determination

scholarly journals Improvement of spatial resolution by tilt correction in near-field scanning microwave microscopy

AIP Advances ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 035114
Author(s):  
Xianfeng Zhang ◽  
Zhe Wu ◽  
Quansong Lan ◽  
Zhiliao Du ◽  
Quanxin Zhou ◽  
...  
Keyword(s):  
Spatial Resolution ◽  
Near Field ◽  
Tilt Correction ◽  
Microwave Microscopy ◽  
Scanning Microwave Microscopy ◽  
Near Field Scanning

Determination of geometric properties of SNOM tips by means of combined far-field and near-field evaluation

1999 ◽  
Author(s):  
Soenke Seebacher ◽  
Wolfgang Osten ◽  
Werner P. O. Jueptner ◽  
Vadim P. Veiko ◽  
Nikolay B. Voznesensky
Keyword(s):  
Near Field ◽  
Field Evaluation ◽  
Far Field ◽  
Geometric Properties

Characterization and Control of Copper CMP with Optoacoustic Metrology

2001 ◽  
Vol 671 ◽  
Author(s):  
Michael Gostein ◽  
Paul Lefevre ◽  
Alex A. Maznev ◽  
Michael Joffe
Keyword(s):  
Film Thickness ◽  
Spatial Resolution ◽  
Chemical Mechanical Polishing ◽  
High Spatial Resolution ◽  
Mechanical Polishing ◽  
Length Measurement ◽  
And Control ◽  
Non Destructive

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

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