scholarly journals Elastic stiffness of L10 FePt thin film studied by picosecond ultrasonics

2011 ◽  
Vol 98 (10) ◽  
pp. 101911 ◽  
Author(s):  
N. Nakamura ◽  
A. Uranishi ◽  
M. Wakita ◽  
H. Ogi ◽  
M. Hirao ◽  
...  
Keyword(s):  
Thin Film ◽  
Elastic Stiffness ◽  
Picosecond Ultrasonics

scholarly journals Elastic stiffness of metallic multilayers studied by picosecond ultrasonics: improved interpretation of interface elasticity

2019 ◽  
Vol 58 (7) ◽  
pp. 075504
Author(s):  
Nobutomo Nakamura ◽  
Ryo Yokomura ◽  
Nobutaka Takeuchi ◽  
Daiki Yamakado ◽  
Hirotsugu Ogi
Keyword(s):  
Elastic Stiffness ◽  
Metallic Multilayers ◽  
Interface Elasticity ◽  
Picosecond Ultrasonics

Advanced Bulge Test System

1997 ◽  
Vol 505 ◽  
Author(s):  
H. Keiner ◽  
F. J. von Preissig ◽  
H. Zeng ◽  
M. N. G. Nejhad ◽  
E. S. Kim
Keyword(s):  
Thin Film ◽  
Elastic Stiffness ◽  
Test System ◽  
Bulge Test ◽  
Testing System ◽  
Test Case ◽  
Established Method ◽  
Bulge Testing ◽  
Speed Accuracy ◽  
Key Innovations

ABSTRACTThe bulge test is an established method of measuring the residual stress and elastic stiffness of thin-film materials. We present an advanced experimental bulge-testing system that provides advantages in speed, accuracy, and flexibility. Key innovations include the use of a Laser Doppler Displacement Meter to measure deflection, an actuated air-cylinder mechanism to vary pressure, and sophisticated computer handling of data acquisition and analysis. A test case demonstrates that repeatability of results is extremely good.

Picosecond Ultrasonics Studies of the Effect of Ion Implantation on InterfAcial Bonding Between a thin Film and a Substrate

1997 ◽  
Vol 505 ◽  
Author(s):  
G. Tas ◽  
J. J. Loomis ◽  
H. J. Maris ◽  
A. A. Bailes ◽  
L. E. Seiberling
Keyword(s):  
Thin Film ◽  
Silicon Substrate ◽  
Metal Film ◽  
Ion Irradiation ◽  
Interfacial Bonding ◽  
Gold Films ◽  
Acoustic Vibrations ◽  
Helium Ions ◽  
Acoustic Damping ◽  
Picosecond Ultrasonics

ABSTRACTWe have used picosecond ultrasonics to study the effects of ion irradiation on the interfacial bonding between gold films and a silicon substrate. Acoustic vibrations are excited in the metal film when a picosecond light pulse is absorbed. The rate at which these vibrations damp out via sound transmission across the interface into the substrate gives a measure of the adhesion of the film to the substrate. The films were irradiated with 2.5 MeV helium ions with doses between 7×1014 and 8×1016 ions cm-2. The adhesion, as measured by the rate of acoustic damping, was found to be significantly improved by the ion irradiation.

scholarly journals Characterization of thin-film adhesion and phonon lifetimes in Al/Si membranes by picosecond ultrasonics

2017 ◽  
Vol 19 (5) ◽  
pp. 053019 ◽  
Author(s):  
Martin Grossmann ◽  
Martin Schubert ◽  
Chuan He ◽  
Delia Brick ◽  
Elke Scheer ◽  
...  
Keyword(s):  
Thin Film ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Picosecond Ultrasonics

scholarly journals Fast Recovery of Elastic Stiffness in Ag Thin Film Studied by Resonant-Ultrasound Spectroscopy

2009 ◽  
Vol 48 (7) ◽  
pp. 07GA02 ◽  
Author(s):  
Nobutomo Nakamura ◽  
Takeo Nakashima ◽  
Hirotsugu Ogi ◽  
Masahiko Hirao ◽  
Masayoshi Nishiyama
Keyword(s):  
Thin Film ◽  
Elastic Stiffness ◽  
Fast Recovery ◽  
Resonant Ultrasound Spectroscopy ◽  
Resonant Ultrasound
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