scholarly journals Characterization of thin-film adhesion and phonon lifetimes in Al/Si membranes by picosecond ultrasonics

2017 ◽  
Vol 19 (5) ◽  
pp. 053019 ◽  
Author(s):  
Martin Grossmann ◽  
Martin Schubert ◽  
Chuan He ◽  
Delia Brick ◽  
Elke Scheer ◽  
...  
Keyword(s):  
Thin Film ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Picosecond Ultrasonics

scholarly journals Characterization of organic ultra-thin film adhesion on flexible substrate using scratch test technique

2012 ◽  
Vol 211 ◽  
pp. 138-142 ◽  
Author(s):  
G. Covarel ◽  
B. Bensaid ◽  
X. Boddaert ◽  
S. Giljean ◽  
P. Benaben ◽  
...  
Keyword(s):  
Thin Film ◽  
Flexible Substrate ◽  
Scratch Test ◽  
Test Technique ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Ultra Thin Film

scholarly journals Opto-Acoustic Method for the Characterization of Thin-Film Adhesion

2016 ◽  
Vol 6 (6) ◽  
pp. 163
Author(s):  
Sanichiro Yoshida ◽  
David Didie ◽  
Daniel Didie ◽  
Tomohiro Sasaki ◽  
Hae-Sung Park ◽  
...  
Keyword(s):  
Thin Film ◽  
Acoustic Method ◽  
Film Adhesion ◽  
Thin Film Adhesion

scholarly journals Characterization of thin film adhesion by MEMS shaft-loading blister testing

2013 ◽  
Vol 31 (3) ◽  
pp. 031102 ◽  
Author(s):  
Maria Berdova ◽  
Jussi Lyytinen ◽  
Kestutis Grigoras ◽  
Anu Baby ◽  
Lauri Kilpi ◽  
...  
Keyword(s):  
Thin Film ◽  
Film Adhesion ◽  
Thin Film Adhesion

scholarly journals Application of Optical Interferometry for Characterization of Thin-Film Adhesion

10.5772/66205 ◽  
2017 ◽  
Author(s):  
Sanichiro Yoshida ◽  
David R. Didie ◽  
Jong-Sung Kim ◽  
Ik-Keun Park
Keyword(s):  
Thin Film ◽  
Optical Interferometry ◽  
Film Adhesion ◽  
Thin Film Adhesion

Thin Film Adhesion Study in Microelectronic Packaging

1991 ◽  
Vol 239 ◽  
Author(s):  
H. S. Jeong ◽  
Y. Z. Chu ◽  
M. B. Freiler ◽  
C. Durning ◽  
R. C. White
Keyword(s):  
Thin Film ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Microelectronic Packaging ◽  
Elastic Model ◽  
Blister Test ◽  
Linear Elastic ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Cure Temperature

ABSTRACTFracture energy (Ga) of BPDA-PDA polyimide (PI) on modified and unmodified Si surfaces was measured by the “blister” test as a function of final cure temperature. It is proven quantitatively that surface modification prior to thin film deposition enhances adhesion. Metal adhesion to PI was also measured by the same method. Reproducibility of the data was found to be exceptionally good for both cases. The linear elastic model is quite valid for the test of thin film adhesion. Therefore, it is believed that this test is best suited for Ga measurements in the study of thin film adhesion for microelectronic packaging.

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