Grain boundary diffusivity of Ni in Au thin films and the associated degradation in electrical contact resistance due to surface oxide film formation

2013 ◽  
Vol 113 (11) ◽  
pp. 114906 ◽  
Author(s):  
N. Argibay ◽  
M. T. Brumbach ◽  
M. T. Dugger ◽  
P. G. Kotula
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Oxide Film ◽  
Contact Resistance ◽  
Film Formation ◽  
Electrical Contact ◽  
Surface Oxide Film ◽  
Electrical Contact Resistance ◽  
Au Thin Films ◽  
Boundary Diffusivity

Influence of a rapid annealing on the surface oxide film of a tinned copper wire

1991 ◽  
Vol 6 (3) ◽  
pp. 492-498
Author(s):  
Isabelle Gillet ◽  
Lionel Boyer ◽  
Camille Bodin ◽  
Germaine Binder
Keyword(s):  
Oxide Film ◽  
Tin Oxide ◽  
Copper Wire ◽  
Electrical Contact ◽  
Continuous Annealing ◽  
Surface Oxide Film ◽  
Tin Coating ◽  
Electrical Contact Resistance ◽  
Joule Effect ◽  
Rapid Annealing

A continuous annealing, using the Joule effect, is performed during the fabrication of a tinned copper wire. During this operation, which lasts between 1/10 and 1/100 of a second, the wire is brought in air to a temperature which exceeds the melting point of tin. The influence of the continuous annealing on the nature of the surface layer of the tin coating is studied using XPS. The thickness of the tin oxide film covering the metallic tin is shown to be reduced after the annealing. This result is confirmed by measurements of the electrical contact resistance using the crossed rods method.

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