Surface chemical-bonds analysis of silicon particles from diamond-wire cutting of crystalline silicon

Journal of Applied Physics ◽

10.1063/1.4972193 ◽

2016 ◽

Vol 120 (23) ◽

pp. 235308 ◽

Author(s):

Anass Benayad ◽

Hamza Hajjaji ◽

Fabrice Coustier ◽

Malek Benmansour ◽

Amal Chabli

Keyword(s):

Crystalline Silicon ◽

Chemical Bonds ◽

Surface Chemical ◽

Diamond Wire ◽

Wire Cutting ◽

Silicon Particles

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Diamond Wire Cutting of the Tokamak Fusion Test Reactor Vacuum Vessel. Innovative Technology Summary Report

10.2172/769191 ◽

2000 ◽

Author(s):

Keyword(s):

Innovative Technology ◽

Vacuum Vessel ◽

Summary Report ◽

Diamond Wire ◽

Wire Cutting ◽

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Abrasive Water-Jet and Diamond Wire-Cutting Technologies Used in the Removal of Marine Structures

10.4043/12022-ms ◽

2000 ◽

Author(s):

John W. Brandon ◽

Bob Ramsey ◽

James W. Macfarlane ◽

David Dearman

Keyword(s):

Water Jet ◽

Abrasive Water Jet ◽

Marine Structures ◽

Diamond Wire ◽

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Thermal pretreatment of diamond wire sawn multi-crystalline silicon wafers for wet acid texturization of solar cells

Materials Research Express ◽

10.1088/2053-1591/aaf118 ◽

2018 ◽

Vol 6 (2) ◽

pp. 025911

Author(s):

Jinbing Zhang ◽

Hongping Fu ◽

Xingfang Ye ◽

Lang Zhou

Keyword(s):

Solar Cells ◽

Crystalline Silicon ◽

Silicon Wafers ◽

Thermal Pretreatment ◽

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Investigation of the relationship between cutting angles and wearing on beads in diamond wire cutting method

Mine Planning and Equipment Selection 2000 ◽

10.1201/9780203747124-125 ◽

2018 ◽

pp. 661-666 ◽

Author(s):

Y. Özçelik ◽

S. Kulaksiz

Keyword(s):

Cutting Method ◽

Diamond Wire ◽

Wire Cutting ◽

The Relationship

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Impurity Removal from Diamond-Wire Cutting Waste by Slag Refining and Electromagnetic Stirring

JOM ◽

10.1007/s11837-020-04184-7 ◽

2020 ◽

Vol 72 (7) ◽

pp. 2648-2655 ◽

Author(s):

Yunyang Zhu ◽

Jijun Wu ◽

Qiliang Wang ◽

Wenhui Ma ◽

Kuixian Wei ◽

...

Keyword(s):

Electromagnetic Stirring ◽

Diamond Wire ◽

Impurity Removal ◽

Slag Refining ◽

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Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon

Precision Engineering ◽

10.1016/j.precisioneng.2017.04.011 ◽

2017 ◽

Vol 50 ◽

pp. 32-43 ◽

Author(s):

Takaaki Suzuki ◽

Yuki Nishino ◽

Jiwang Yan

Keyword(s):

Material Removal ◽

Crystalline Silicon ◽

Subsurface Damage ◽

Single Crystalline Silicon ◽

Single Crystalline ◽

Diamond Wire ◽

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Challenges associated with diamond wire sawing when generating reduced thickness mono-crystalline silicon wafers

2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC) ◽

10.1109/pvsc.2016.7749697 ◽

2016 ◽

Author(s):

Joseph Walters ◽

Kirsten Sunder ◽

Oliver Anspach ◽

R. Paul Brooker ◽

Hubert Seigneur

Keyword(s):

Crystalline Silicon ◽

Silicon Wafers ◽

Diamond Wire ◽

Diamond Wire Sawing

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Preparation of α‐Si 3 N 4 by direct nitridation using polysilicon waste by diamond wire cutting

International Journal of Applied Ceramic Technology ◽

10.1111/ijac.13254 ◽

2019 ◽

Vol 17 (1) ◽

pp. 84-93 ◽

Author(s):

Yong Hou ◽

Guo‐Hua Zhang ◽

Kuo‐Chih Chou

Keyword(s):

Diamond Wire ◽

Wire Cutting ◽

Direct Nitridation

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Optimization of diamond wire cutting performance in travertine quarrying

Bulletin of Engineering Geology and the Environment ◽

10.1007/s10064-017-1084-6 ◽

2017 ◽

Vol 77 (4) ◽

pp. 1793-1801

Author(s):

Mohammad Javad Rahimdel ◽

Raheb Bagherpour

Keyword(s):

Cutting Performance ◽

Diamond Wire ◽

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The removal of saw marks on diamond wire-sawn single crystalline silicon wafers

Journal of the Korean Crystal Growth and Crystal Technology ◽

10.6111/jkcgct.2016.26.5.171 ◽

2016 ◽

Vol 26 (5) ◽

pp. 171-174

Author(s):

Kyoung Hee Lee

Keyword(s):

Crystalline Silicon ◽

Silicon Wafers ◽

Single Crystalline Silicon ◽

Single Crystalline ◽

Diamond Wire ◽

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